D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric environment. Model:JYPJ-1000 JYPJ-1000 system accurately meters, m
D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric environment. Model:JYPJ-1000 JYPJ-1000 system accurately meters, m
Metal/Plastic/Stainless Steel 20W Fiber Laser Marking Machine laser length 1060nm Laser Power 10 / 20 / 30 / 50 / 100 W Machine size About 650×800×1370mm Machine weight About 110KG Product description: Metal/Plastic/Stainless Steel
New Equipment | Industrial Automation
Metal/Plastic/Stainless Steel 20W Fiber Laser Marking Machine laser length 1060nm Laser Power 10 / 20 / 30 / 50 / 100 W Machine size About 650×800×1370mm Machine weight About 110KG Product description: Metal/Plastic/Stainless Steel 20W Fiber L
New Equipment | Industrial Automation
Portable Laser Marking Machine with Laptop LM-106 Wave length 1060nm Power 20W Minimum linewidth 0.012mm Range 110mm X 110mm Product description: Portable Laser Marking Machine with Laptop LM-106, Wavelength 1060nm, Power 20W, Minimum linewidt
New Equipment | Coating Equipment
Can be customized online or offline according to customer requirements Advantage characteristics Mechanized production instead of the traditional manual dispensing. Mature three-axis mechanism to make the device more accurate and stable position
Industry News | 2011-02-15 20:00:39.0
Krayden, Inc. releases Dow Corning's HM-2500 Assembly Sealant. The new sealant features hot-melt technologies that provide instant hold, resulting in lower costs and increased productivity improvement.
Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
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