Used SMT Equipment | Adhesive Dispensers
Features 1. Uses the high accuracy timing control electric circuit to guarantee dispensing evenly. 2. .Have vacuum Suck-back ensures no dripping. 3. Operation simple, Adjustment and replacement mold is easily. 4. Based on the size of oval
Accurately senses component temperatures without soldering or taping! TEMPROBE™ is a patented, precision temperature sensing instrument. The subminiature thermocouple tip can be placed anywhere on a board, including profiling in wet solder paste or
Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Kapton®tapes are polyimide polymers in the form of a film. Kapton?polyimide tapes are also known as high temperature tape or polyimide tape. Some of the characteristics of the Kapton®polyimide tape are: It maintains an excellent physical and electri
Industry Directory | Consultant / Service Provider / Manufacturer
We do Component Level Repair training on Laptops, including BGA work, and hand soldering all SMD components.Included in our packages is the ability to fault find and diagnose problems in circuits.
Industry Directory | Consultant / Service Provider / Manufacturer
PROPOX is a manufacturer of electronics, industrial automatics, telemetric systems, tools, modules and evaluation circuits used by the constructors of electronics.
Model:PGB-200, Whatsapp(0086-134 2516 4065) PGB-200 system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syringe filling. For variable ratio dispensing, the
China Meter Mix Dispensing Machine for Silicone, Epoxy Resin, Polyurethane Resin Whatsapp +86 134 2516 4065 Model: kpd-1000 Our system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,
Technical Library | 2016-01-12 11:04:35.0
3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20-40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won’t help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail.
New Equipment | Cleaning Agents
LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t
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