Electronics Forum | Wed Feb 05 11:38:46 EST 2003 | Stephen
Don't forget placement. I"ve seen chips broken when they are being placed because they were thicker than the parts data used for them. This is not an issue on Panasonic machines because they measure the thickness of parts but I have seen it happen
Electronics Forum | Thu Oct 28 08:28:33 EDT 2010 | d0min0
Hi, previous topics found closed so I couldn't continue on them, but wanted to ask maybe something that we don't already know paste shape and placement ok, reflow 12 zones profile looks ok (same since 2 yrs), component placement ok, one reference i
Electronics Forum | Thu Sep 27 15:09:24 EDT 2012 | ericrr
I notice that someone has set all the capacitors & resistors parts as emboss instead of paper tape. Does this make any difference to the pick and placement of the parts, By the way recently we changed from 1206 to 0603 parts, coming out of the mac
Electronics Forum | Mon Apr 28 18:34:17 EDT 2003 | Brian W.
We typically do not try to pick up and hand placve chip resisstors and capacitors. The risk and cost is too high for components that are a penny or less. We take into consideration that on many of our components, someone will have to test them to v
Electronics Forum | Thu Jul 20 12:44:21 EDT 2000 | Ketan Bhatt
We have difficulty in placing a trimmer capacitor chip using our Philips CSM 84 VIII pick and place machine. This Trimmer capacitor is supplied by Murata and its partno is TZBX4P300BA110T00 and value is 4.7~30 pf. While trying to place the componen
Electronics Forum | Fri Mar 23 02:22:13 EDT 2007 | bvdb
Latest information: The IP-1 packed up completely this week showing an assortment of weird error messages. The CPU was still running but the +24VDC power supply LED was off and nothing would work (emergency stop mode always enabled). Pulling the +
Electronics Forum | Fri Feb 11 08:24:51 EST 2000 | Masdi
Hi, Need help. We are starting to see a lot of small solder under capacitors and some of them can be bigger than 10 mils. For current action, we have checked through screen print process and component placement but still don't have any clue on how
Electronics Forum | Tue Jun 27 10:36:45 EDT 2000 | Bill Bannister
We've been experiencing solder balls on 0805 caps. We have modified the reflow profile and had some success, but some balling still persists. The balls always form from under the cap between the lands. I measured the distance between the lands at .03
Electronics Forum | Wed Jun 29 17:56:47 EDT 2005 | Ryan
We have a new Heller 1809 EXL reflow oven and when we run MELF�s or Aluminum Electrolytic Capacitors through the oven they are being blown off the pads. I have verified that the placement is good before reflow. I verified that they are pushed down
Electronics Forum | Fri Sep 08 10:16:24 EDT 2006 | slthomas
We had problems with Panasonic film caps with a previous employer. The first step was to use their recommended pad layouts rather than industry standards for the part sizes. The second much more helpful resolution was to complain like hell to Panaso
