Industry News | 2017-05-20 15:06:05.0
PCB array panelization can be a major challenge for PCB designers. Learn best practices for designing PCB boards for most efficient panelization.
Electronics Forum | Fri Mar 31 21:33:56 EST 2006 | mrduckmann2000
jdumont, We have a capacitor and an inductor that stick up approx 2.5", any problems with the spray nozzle working around tall objects? Thank you for your input.
Electronics Forum | Tue Jan 29 08:21:50 EST 2019 | electronics101
Hi All, Can someone please help, I have a number of tall surface mount components that according to IPC 610 (8.2.2.3) are a fail due to the end termination not wetting at least 0.5mm + solder height. The components are very well soldered but the sol
Electronics Forum | Wed Aug 20 08:23:36 EDT 2008 | davef
Your tantalum capacitor supplier offers the best advice. We're not sure of the package that you plan to use. * If you are referring to molded package, surface mount, tantalum caps, yes, they can be wave soldered. Smaller case size chips (eg, Kemet A
Electronics Forum | Wed Jul 01 01:25:58 EDT 2020 | jmelson
> I think the main > issue is the bend radius you can apply to tape > with deeper pockets. Right, on my Philips CSM84, on the larger tapes, I don't thread the tape through the return slot, I let it play out the front of the feeder. The
Electronics Forum | Sat Jul 12 03:45:19 EDT 2014 | comatose
If you're getting quoted .045 seconds per chip, or .9 seconds per IC, one of two things is happening. The most likely is the supplier has two machines in the line, one placing small parts quickly, and one placing large parts slowly. The part will run
