New Equipment | Component Counters / SMD Counters
Counting the quantity of parts is fully automatic; it’s convenient for counting parts, feeding parting and inventory management. Reel derailment protection device is provided against for tapes fall off; it’s easy to adjust by tighten and loosen. A
Commercial-off-the-shelf (COTS) PC/104 and PC/104-Plus computer cards and components, including x86 and PowerPC CPUs; DC/DC converter power supplies and interfaces; fan cards and heatsinks; digital I/O and mass storage boards; fieldbus interfaces (C
Electronics Forum | Tue Oct 17 17:27:08 EDT 2006 | adlsmt
Define "pretty easily". Did anyone ever do whatever is making them fall off now before? In most casses where a component "falls off" then someone implements a totally subjective test to make sure the rest of the parts wont "fall off" they damage a lo
Electronics Forum | Tue Oct 17 15:31:29 EDT 2006 | TM
I've got some MELF packages that reflow and connect but later fall out of the solder pretty easily. We are not using epoxy but, the parts have fillets per IPC standards. We have not looked at cross-sectioning for IMC and don't plan to at the moment
Used SMT Equipment | In-Circuit Testers
80 dB, rise/fall time SM-B8 = Pulse Modulator: on/off ratio >80 dB, rise/fall time SM-B9= Pulse Modulator: on/off ratio >80 dB, rise/fall time SM-B4 = Pulse Generator: only in conjunction with SM-B3/SM-B8/SM-B9; provides single, delayed and dou
Used SMT Equipment | In-Circuit Testers
Kikusui PLZ1004W DC Electronic Load (E-Load), 1.5 to 150V, 200A, 1000W , Rise time: 10 Micros (which converts to rise and fall times) high-speed response, Possible to perform actual Load simulation by sequence control function, Equipped with USB
Industry News | 2003-03-06 08:29:50.0
Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
Parts & Supplies | Chipshooters / Chip Mounters
161575 ETCHED DISC (FLOW RESTRICTOR) 161555 O-RING 18 I/D X 3 SECTION 161438 FILTER GASKET (CUT-OFF VALVE) 161371 CLP INT M1300/13 161269 O-RING 6.07id x 1.78 SECTION 161264 COMP. SPRING, STEM (FLUID CUT-OFF VALVE) 161263 SCREW, S
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Parts & Supplies | Pick and Place/Feeders
Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old part. 5322 442 01529) Part No. Description 5322 214 91436 BOARD, PIPETTE 5322 214 91038 TRANSPORT CONTROLLER FCM 5322 216 04091 TRANSP CONTRL ACM-AX201 5322 214 91771 CONTROLLER BVM 949
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/about-adhesives/sustainability/replace
. Transport and warehousing Provide slip resistance to each package and minimize shift load Reduce product damage and prevent potential accidents due to products falling off Column
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