Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Technical Library | 2024-03-19 15:53:34.0
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board.
Industry News | 2003-02-17 08:21:41.0
HDI Sales Made Up Larger Share of Net Sales in 4Q
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-05-08 07:11:45.0
InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.
Parts & Supplies | SMT Equipment
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Parts & Supplies | SMT Equipment
DEK folder side bracket-158815(new) Description: DEK folder side bracket (new) CARRIER ^ BOARD CLAMP ^ TRANSPORT RAILS ^ 500 Part NO.: 158815 Applicable models: ELAI/HOZ-02I/HOZ-03I/API
Parts & Supplies | Screen Printers
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Parts & Supplies | SMT Equipment
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Parts & Supplies | SMT Equipment
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