Industry News | 2020-04-24 04:09:42.0
With an increasing awareness of environmental protection, companies are having difficulties looking for leaded assembly solution providers. However, some advantages of leaded solder make it irreplaceable for manufacturing certain electronics devices. This time, Regulus would like to tell you more about leaded PC boards and the benefits it brings to electronic products.
Industry News | 2014-07-28 15:50:58.0
Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2018-04-09 10:49:39.0
(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2011-07-13 15:41:41.0
SEHO Systems GmbH announces that its recent seminars in the United States were a success.
Industry News | 2022-05-05 17:10:49.0
SMTconnect, which will take place from 10-12 May in Nuremberg offers a highly relevant program for visitors to the exhibition. With important exhibitors in the industry showcasing their latest developments, the fair provides an opportunity to connect, create and drive technology.
Industry News | 2008-05-03 17:09:31.0
HUDSON, NH � May 1, 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that statistical process control (SPC) is the key to combining high quality with low costs.
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
Industry News | 2023-08-21 12:19:15.0
Gen3, a global leader in SIR (Surface Insulation Resistance), CAF (Conductive Anodic Filament), solderability, ionic contamination, and process optimization equipment, along with Zestron, renowned experts in cleaning and reliability solutions, are thrilled to announce an enlightening workshop focused on Electronics Manufacturing Processes: Where Quality Assurance Meets Surface Reliability. This informative seminar is scheduled to take place on Wednesday, September 6, 2023, at the Manufacturing Technology Centre in Ansty Park, Coventry.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2023-08-17 09:37:57.0
XJTAG®, a leader in JTAG boundary scan products, will be presenting a talk entitled "Introduction to Accelerated PCBA Testing and Programming" at FPGAworld™ in Stockholm on September 12th, 2023.
Industry News | 2009-11-03 08:30:01.0
Munich, Germany, November 3, 2009 --- There are clear indications of improving participation in productronica 2009, a very positive trend change indication.
