Full Site - : cause of cold solder (Page 7 of 38)

The necessity of X-ray inspection for SMT BGA soldering quality control

Industry News | 2021-06-10 02:42:13.0

With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.

Unicomp Technology Co., Ltd

Koh Young Technology Celebrates 15 Years of Success in Providing Total 3D Inspection Solutions

Industry News | 2017-05-30 20:05:30.0

3D inspection technology leader Koh Young Technology marked 15 years of continuous success in providing Total 3D inspection solutions to SMT/PCB assembly and other manufacturing industries. Koh Young celebrated its 15th Foundation Day on May 1, 2017. Established in 2002, Koh Young has led the industry in providing the world’s most advanced 3D measurement quality assurance solutions, including its market-leading Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems.

Koh Young America, Inc.

Koh Young Technology is Showing its Award-winning Suite of True 3D Inspection Solutions at NEPCON China

Industry News | 2021-04-21 10:17:09.0

Seoul, South Korea – At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.

Koh Young America, Inc.

Koh Young Technology is Showing its Award-winning Suite of True 3D Inspection Solutions at NEPCON China

Industry News | 2021-04-29 16:58:08.0

At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.

Koh Young America, Inc.

Effect of Silicone Contamination on Assembly Processes

Technical Library | 2013-02-07 17:01:46.0

Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Harris Corporation

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

Industry News | 2021-05-21 03:59:59.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.

MacDermid Alpha Electronics Solutions

Soldering of SMD Film Capacitors in Practical Lead Free Processes

Technical Library | 2009-06-02 23:53:18.0

Today the lead free soldering process is a must in commercial electronics and it is also coming more and more important in automative and industrial electronics sectors in the near future. The most common choices for lead free solders are different Tin-Solder-Copper (SAC) alloys. Processes using SAC solders cause extra stress, because of increased process temperatures, especially to the plastic materials.

KEMET Electronics Corporation

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

Localization of high-power lasers is accelerating, and development bottlenecks need to be broken. Vacuum reflow soldering helps

Industry News | 2019-12-10 05:28:49.0

As early as 2011, TORCH began to develop vacuum welding furnaces. In 2014, it began to sell two series of high-power laser vacuum vacuum reflow oven, namely V4 series and RS series, in the laser industry. At the same time, in 2014, TORCH won the "national torch industrialization demonstration project certificate". After five years of continuous upgrading, TORCH in superpower laser vacuum reflow welding technology is becoming more and more mature, can completely replace the German and the United States ATV vacuum reflow oven. The realization of the key equipment of the autonomous power laser industry controlled, for the localization and the development of high power laser industry contributes own strength. Beijing TORCH wants to help the users on IGBT, high power laser machines and other industries lower cost and improve reliability.

Beijing Technology Company

How to inspect the temperature recovering time of thermal shock chamber?

Technical Library | 2019-11-12 02:09:22.0

Thermal shock test chamber can be used for testing the chemical change or physical damage on composite materials caused by the thermal expansion and contraction of the sample in the shortest time,which is subjected to extremely and continuous high and low temperature environment.so how to check the temperature recovery time of this chamber? Normally we take following steps to inspect the temepratuire recovering time: 1.Install the temperature sensor at the specified position, and adjust the temperature controller of hot zone and cold zone to the required nominal temperature respectively. 2.The temperature increases and reduces respectively,30min after temperature in two zones reach stable status,record temperature value of the measuring point,pls set the temperature value of two zones to be required nominal temperature. 3.The temperature shock test chamber automatically places the inspected load into theh ot zone,select the corresponding retention time according to regulated standard. 4.Set the transfer time,then the inspection load is transferred from hot zone to cold zone, and the temperature of the measuring point is observed and recorded, and then the reverse conversion of the load from cold zone to hot zone is carried out according to the same method, and the temperature of the measuring point is observed and recorded. www.climatechambers.com

Symor Instrument Equipment Co.,Ltd


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