Industry News | 2021-04-29 16:58:08.0
At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Technical Library | 2003-04-18 12:05:57.0
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem.
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
Technical Library | 2013-02-07 17:01:46.0
Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Industry News | 2021-05-21 03:59:59.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.
Industry News | 2004-11-19 15:47:39.0
Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.
Industry News | 2019-12-10 05:28:49.0
As early as 2011, TORCH began to develop vacuum welding furnaces. In 2014, it began to sell two series of high-power laser vacuum vacuum reflow oven, namely V4 series and RS series, in the laser industry. At the same time, in 2014, TORCH won the "national torch industrialization demonstration project certificate". After five years of continuous upgrading, TORCH in superpower laser vacuum reflow welding technology is becoming more and more mature, can completely replace the German and the United States ATV vacuum reflow oven. The realization of the key equipment of the autonomous power laser industry controlled, for the localization and the development of high power laser industry contributes own strength. Beijing TORCH wants to help the users on IGBT, high power laser machines and other industries lower cost and improve reliability.
Technical Library | 2009-06-02 23:53:18.0
Today the lead free soldering process is a must in commercial electronics and it is also coming more and more important in automative and industrial electronics sectors in the near future. The most common choices for lead free solders are different Tin-Solder-Copper (SAC) alloys. Processes using SAC solders cause extra stress, because of increased process temperatures, especially to the plastic materials.
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Technical Library | 2019-11-12 02:09:22.0
Thermal shock test chamber can be used for testing the chemical change or physical damage on composite materials caused by the thermal expansion and contraction of the sample in the shortest time,which is subjected to extremely and continuous high and low temperature environment.so how to check the temperature recovery time of this chamber? Normally we take following steps to inspect the temepratuire recovering time: 1.Install the temperature sensor at the specified position, and adjust the temperature controller of hot zone and cold zone to the required nominal temperature respectively. 2.The temperature increases and reduces respectively,30min after temperature in two zones reach stable status,record temperature value of the measuring point,pls set the temperature value of two zones to be required nominal temperature. 3.The temperature shock test chamber automatically places the inspected load into theh ot zone,select the corresponding retention time according to regulated standard. 4.Set the transfer time,then the inspection load is transferred from hot zone to cold zone, and the temperature of the measuring point is observed and recorded, and then the reverse conversion of the load from cold zone to hot zone is carried out according to the same method, and the temperature of the measuring point is observed and recorded. www.climatechambers.com
