Simple, easily applied, and effective methods, materials and instrumentation will save you big and hidden expenses incurred to pay for production rejects and unexpected, post shipment guarantee repairs caused by Electrostatic Discharge. Professional
The inspection of welded tanks is a time-costly procedure. Modern real-time DR-systems result in a huge efficiency gain in comparison to the conventional film (RT) approach. VisiConsult developed a cutting edge custom system with weld tracking, defec
Electronics Forum | Thu Nov 01 05:30:06 EST 2001 | wbu
This is not about the physical laws but besides contamination, which will actually IMO cause NO WETTING, it is quite vital that the time-limit the flux is active is not exceeded during your reflow process. Depending on your paste/flux you will have a
Electronics Forum | Thu Nov 01 12:13:10 EST 2001 | jonathan
I guess this clarifies the defect more then looks at the process, but I�ll just through it out there for the sake of learning something new. If anyone would comment on this please feel free�. There are many different varieties of dewetting defects.
Industry News | 2003-03-06 08:29:50.0
Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably
Industry News | 2003-05-29 08:40:51.0
Withdrawal of Nam Tai's registration statement filed on Form F-3 for a proposed offering of 3,000,000 common shares of the company
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Parts & Supplies | Pick and Place/Feeders
Samsung nozzle of TN series & CN series Samsung Nozzle Samsung nozzle of TN series & CN sereis Usage:Samsung pick and place machine Product description: Samsung nozzle of TN series & CN sereis Issues related to improper nozzle/f
Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2023-09-13 13:03:25.0
SMT auto aqueous stencil cleaning machines are an essential tool for any SMT production line. These machines use a variety of methods to remove contaminants and debris from SMT stencils, which can cause defects and reliability issues.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Welcome to this Defect of the Month video on monitoring flux application for wave and selective, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the l
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The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
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SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
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X-Ray of PCBs Webtorial
Career Center | Williamsport, Pennsylvania USA | Engineering,Quality Control
Corporate Director of Quality- Works on site in Williamsport, PA Reports to VP of Operations Summary The Quality Director is responsible for assuring the program health and operation of the overall quality management systems and the Quality A
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
Imagineering, Inc. | https://www.pcbnet.com/blog/causes-of-pcb-warping-how-to-prevent-it/
Causes of PCB Warping & How to Prevent It | Imagineering, Inc. Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
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. Process and design-related causes: • Excessive volume of solder due to improper pad dimension • Excessive volume of solder due to improper stencil aperture
