Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Industry News | 2022-05-05 17:10:49.0
SMTconnect, which will take place from 10-12 May in Nuremberg offers a highly relevant program for visitors to the exhibition. With important exhibitors in the industry showcasing their latest developments, the fair provides an opportunity to connect, create and drive technology.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito
Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s
Electronics Forum | Sat Nov 08 08:16:45 EST 2003 | davef
We saw this quite a bit, I want to say 5 or 6 years ago, but it's probably more like 10 years ago. It's caused by poor solder mask crue. Talk to your board fabricator about solutions.
Electronics Forum | Sat Nov 08 09:42:22 EST 2003 | ethercom
Hi: I have seen this problem before. It is caused by improper curing of solder mask by the fab manufacturer. When you run the board thru' wave solder, and then wash the board, you see the problem of white residue. However, when you apply heat, you c
Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef
Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of
Electronics Forum | Fri Nov 07 12:48:31 EST 2003 | rholland
I have seen in the last couple of months more boards with a white hazing under the solder mask. I ran a few tests on a board to determine the cause of the white hazing underneath the solder mask. First I confirmed, or at least I think I confirmed, t
Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
