Full Site - : causes of tombstoning (Page 4 of 90)

The SMTA Capital Chapter to Host Second Meeting of the Year on May 16th at DfR Solutions

Industry News | 2013-04-29 15:22:12.0

The SMTA Capital Chapter is pleased to announce its upcoming meeting on May 16, 2013, from 5:30 pm until 8 pm at DfR Solutions’ brand new facility in Beltsville, Maryland.

Surface Mount Technology Association (SMTA)

IPC Study Identifies Costs of SEC Conflict Minerals Due Diligence at 17 Times More than Government Estimates

Industry News | 2011-03-11 14:53:57.0

A new study conducted by IPC — Association Connecting Electronics Industries® predicts that reporting requirements for conflict minerals proposed by the U.S. Security and Exchange Commission (SEC) would cost the electronic interconnect industry an estimated $279 million in the first year of implementation for due diligence alone, compared to the government’s estimate of $16.5 million.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter Presents “Enabling Implementation of Advanced Technologies” Tutorial Program on June 9th at ZESTRON Americas

Industry News | 2015-05-18 21:19:33.0

The SMTA Capital Chapter is pleased to announce it will welcome Denis Barbini, Universal Instruments Corporation, on June 9th to instruct a tutorial on Advanced SMT Technologies at ZESTRON Americas located at 11285 Assett Loop, Manassas, VA 20109. The tutorial is scheduled from 9:00 am to 4:30 pm and includes lunch. The following should attend: quality engineers, failure analysis engineers, reliability engineers, procurement specialists, design engineers, process engineers, project managers. Registration is required for this learning event.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman

Industry News | 2015-05-18 21:29:50.0

The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.

Surface Mount Technology Association (SMTA)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

LEADING EXPERTS TAKE TIN WHISKERS FROM THEORY TO PRACTICE AT IPC CONFERENCE Are we understating the use of tin whisker risk mitigation methodologies?

Industry News | 2012-03-26 15:58:58.0

Tin whisker growth, risk mitigation, detection and failure analysis will be the focus of the IPC Tin Whiskers Conference, April 17–19, 2012, in Ft. Worth, Texas.

Association Connecting Electronics Industries (IPC)

Find out Why It Is Important to Change the Perception of Manufacturing at the Women's Leadership Program during SMTA International 2022

Industry News | 2022-09-30 11:19:51.0

The Women's Leadership Program (WLP) announces that it will host presentations about technology innovations and career advancements from 1-3:15 p.m. CST on Tuesday, November 1, 2022.

Surface Mount Technology Association (SMTA)

Investigation of Through-Hole Capacitor Parts Failures Following Vibration and Stress Testing

Technical Library | 2019-06-21 10:39:15.0

Recently, an ACI Technologies (ACI) customer called to discuss failures that they had observed with some through-hole capacitor parts. The components were experiencing failures following vibration and accelerated stress testing. Upon receipt of the samples, ACI performed three levels of inspection and Energy Dispersive Spectroscopy (EDS) testing to investigate the root cause of the failures. These analyses enabled ACI to verify the elements comprising the solder joints and make the following recommendations in order to prevent future occurrences. The first inspection was to investigate the capacitor leads using optical microscopy, and no anomalies were found that could indicate bad parts from the vendor or improper handling prior to assembly. However, vertical fill in the barrel of the plated through-holes was too close to the IPC-A-610 minimum specification of 75% to determine a pass/fail condition, and therefore required further investigation.

ACI Technologies, Inc.

SMT Auto Aqueous Stencil Cleaning Machine: Improve the Quality and Efficiency of Your SMT Stencil Cleaning Process

Technical Library | 2023-09-13 13:03:25.0

SMT auto aqueous stencil cleaning machines are an essential tool for any SMT production line. These machines use a variety of methods to remove contaminants and debris from SMT stencils, which can cause defects and reliability issues.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Surface Mount Technology Association (SMTA)


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