Methods in accordance with PRO-STD-001, SAE AS 5553, and SAE AS 6081. Process follows ISO/DIS 12931. Datest tools and training are used to detect packaging damage; ESD compliance violations; falsified or altered documentation; tampered part markin
New Equipment | Solder Paste Stencils
100µm we recommend a special squeegee blade which is adjusted to the cavity size. Benefits: Adjustable paste volumes in one printing process Simultaneous print process on all levels Different paste deposit heights on all levels Available with
Industry Directory | Manufacturer
Promex is a broad technology Silicon Valley based EMS integrating SMT(consigned & full turnkey)with Chip-on-Substrate & Advanced Semiconductor Packaging. ISO 9001, ISO 13485 Medical & ITAR certified.
Industry Directory | Consultant / Service Provider / Manufacturer
Providing production and prototype, SEC offers advanced technologies like LED thermal management, heavy copper, PTFE for RFMW, open and internal cavities and blind and buried vias that are certified to a diverse set of industries.
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
New Equipment | Industrial Automation
Honeywell Operator 51402497-200 -------- (Best Price) (In Stock) Condition: Brand New Warranty: 1 Year Guarantee Delivery: 1-2 Days Shipping: UPS,Fedex,DHL and other Express for choose. How to contact us? Manager: Trixie Email: sales@cambi
Jwide JW-GD450 automatic stencil printer www.jwide-smt.com sales@jwide-smt.com
Technical Library | 2016-04-21 14:10:55.0
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Traditional printed circuit boards utilize the x/y plane and many miniaturization techniques apply to the x/y space savings, such as smaller components, finer pitches, and closer component to component distances.This paper will explore the evolution of 3D assembly techniques, starting from flexible circuit technology, cavity assembly, embedded technology, 3 dimensional surface mount assembly, etc.
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2023-05-10 01:39:38.0
DPC (DirectPlatingCopper) thin film process is a method of prepare copper film using magnetron sputtering technology. This process is a process in which the copper target with the target material is placed in a true cavity chamber, and plasma is generated on the copper target surface by magnetron sputtering technology. The ions in the plasma are bombarded on the surface of the target, which is sputtered into fine particles and deposited on the substrate to form a copper film.
