Full Site - : cca (Page 17 of 23)

Circuit Card Assembly Molding

Electronics Forum | Thu Mar 24 11:04:41 EDT 2011 | smt_guy

Hi, I have a 2.75" x 1" x 0.027"thick CCA with SOIC16W and QFN56 as well as some 0201's, 0402's and QFN16 Components that are to be enclosed via molding process. Is there any Insert Moling, Over Molding Circuit Card Assembly Guidelines out there fr

Circuit Card Assembly Molding

Electronics Forum | Fri Apr 01 17:45:31 EDT 2011 | smt_guy

thanks for all your replies. we tried running our beta runs and have lots of issues. first our molding process which was set to 450'F temp at 1200 PSI smashed the circuit card components and penetrated the epoxy compound we used to encapsulate the C

Adding new line

Electronics Forum | Tue Feb 26 09:32:56 EST 2013 | anton99

Update: We have bought more reels to cover both lines and it has helped enormously. There were about 100 part numbers that were used on both lines over 300 times per year. The majority of them were less than $20.00 a reel. We have also been using My

Melted BGA part

Electronics Forum | Thu Sep 15 09:31:02 EDT 2016 | ladmo1

While removing one part, another part - BGA part - several components away, actually melted on one corner - you can see the plastic body of the part oozing out around one corner between the solder balls. Several of the solder balls on the one corner

Yield levels

Electronics Forum | Thu Jul 18 09:55:05 EDT 2002 | gdstanton

Mike, When we measure solder inspection yield by dividing the number of defective joints on a CCA by the total number of joints on the PWB. A defective joint is classified only once. That is we don't count multiple defects on the same joint. Our

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002

This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre

temperature profile for ENIG

Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek

Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o

Leadless(passives) solder joint criteria

Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner

We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr

Pad Geometry Design Standards

Electronics Forum | Fri Apr 13 22:56:02 EDT 2001 | gdstanton

I've been chipping away on a solder bridging and poor fillet wetting problem for a few weeks now (new to the company) and I found two issues. First, after a review of stencil inventory, I found apertures to be oversized when compared to suggested di

Bake out CCA

Electronics Forum | Mon Jan 08 18:58:27 EST 2007 | Mike F

Normally someone would have replied to tell you to do a search of the archives. I've read at least 4 or 5 different threads dealing with baking out PWB's, but none were for this special material. First, have you contacted the manufacturer of the PW


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