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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
BGA repair machine Factory,bga reballing station,bga repair tools ,bga rework station,iphone repair machine
Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3
- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
Electronics Forum | Thu Jun 19 05:14:18 EDT 2008 | sckee
Hi, Need help on the CCGA solderability criteria.I've actually run a NPI that using CCGA yet not sure whether the solderability is accepted or not. The alloy of the column is 80/20 and the surface of the solder joint is not smooth and shine. By chec
Electronics Forum | Tue Jun 04 12:33:57 EDT 2002 | dason_c
We use the diamond shape on the CBGA/CCGA only, all the PBGA are using the regular round shape.
Used SMT Equipment | Chipshooters / Chip Mounters
30 intelligent spindle assemblies -> All vision processing is performed “on the fly” to maximize throughput. -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras -> narrow field of view c
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Industry News | 2020-11-17 11:26:03.0
TopLine Corporation will exhibit in the 58th annual IEEE Nuclear and Space Radiation Effects Conference (NSREC), which will have its first Virtual Conference and Exhibition beginning November 29 and accessible through December 30. Live virtual Exhibits will be accessible December 1-8.
Parts & Supplies | Repair/Rework
Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking
Technical Library | 2019-07-30 15:29:50.0
Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50°/75°C, -55°/100°C, and -55°/125°C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature data to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.
Welcome to this Defect of the Month video on head in and on pillow, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years there hav
In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
SMTnet Express, April 1, 2021, Subscribers: 27,301, Companies: 11,328, Users: 26,571 Robots are important ... • Robots fetch, analyze and file information from web servers. This makes that content available to Searchers using search
This cell contains DSP_TRAILER.CFM. This is a layout/formatting test. Eventually, useful content will fill this area.