Electronics Forum | Thu Jun 29 13:27:20 EDT 2006 | pjc
Verify that the CEMs machines and processes are capable of assembling the technology of your boards- smallest components, largest components, finest pitch, flex circuits, etc� Are their core competences aligned with your requirements- assembly only,
Electronics Forum | Tue May 24 10:07:50 EDT 2011 | ck_the_flip
Does anyone have experience singulating CEM-1 substrates?
Electronics Forum | Thu Jul 22 02:58:25 EDT 1999 | George Verboven (Process Engineer)
| We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. | | Thanks in advance, | |
Electronics Forum | Mon Aug 05 03:03:50 EDT 2002 | jkhiew
Hi all, I had some old stock of CEM1 pcb: a. How long & under what temp. condition shall I bake it to eliminate the trapped moisture ? b. Is the baking time & temp. different for 3 yrs old stock, 2yrs old stock & 6 month old stock ? c. For CEM1 pcb,
Electronics Forum | Thu Jun 02 15:21:18 EDT 2011 | davef
As long as it has been properly stored, we don't believe that old CEM will singulate any different than new CEM ... either should press well.
Electronics Forum | Mon Sep 25 07:35:04 EDT 2000 | Mikel Rodriguez
Hello, We are using FR-2 in boards 15x10cm size, with SMD and thru hole components (about 100 SMD and 50 thru hole). We have some "rare" problems (flex cracks or caps, diodes, and so on). Would we improve something by using CEM-1 instead of FR-2?? Mo
Electronics Forum | Fri Jul 16 11:29:59 EDT 1999 | John Sims
We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. Thanks in advance, John Sims
Electronics Forum | Tue Sep 05 05:18:20 EDT 2017 | ravnikar39
Dear, has anyone problem after the depanalization of CEM-1 like this (picture in link)? https://drive.google.com/file/d/0B40MYZvzPFWFNnd6ejZYT3k4aVE/view?usp=sharing https://drive.google.com/file/d/0B40MYZvzPFWFaklHQTAydXJ0WFk/view?usp=sharing Is
Electronics Forum | Fri Oct 05 09:15:23 EDT 2001 | Ben Bierlein
It is a PCB material that has a woven glass / epoxy internal core and glass veil surface. It is in between the paper materials (FR1,FR2 and CEM1) and FR-4 as far as strength and cost. It is available in HiCTI material for high power applications.
Electronics Forum | Fri Jun 04 01:13:31 EDT 2010 | boardhouse
Hi fotis, Big difference between Cem3 & FR4 is that FR4 the glass is woven and Cem3 is sheet glass non-woven. for Multi layer product, i would not consider Cem3 due to increase chance of de-lam due to lack of weave for strength. Cem1 and Cem3 are
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