Industry News | 2017-08-06 19:39:48.0
The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2022-11-22 06:14:08.0
Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.
PCB reject conveyor/AOI rework conveyor/NG PCB conveyor/NG reject conveyor, link:https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/130.html PCB reject conveyor is designed for good/bad PCB separation. It can also be used when visua
ASM SMT Chip Shooter SIPLACE TX If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine, ASM SMT m
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
New Equipment | Board Handling - Conveyors
PCB reject conveyor from ASCEN allows PCB printed circuit board manufacturers to easilly isolate bad or reject boards from SMT production line,PCB board rejection is based on up-line process input, typically provided by Automated Optical Inspection (
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2013-01-17 11:15:42.0
One of the “cleanest” areas on the IPC APEX EXPO® show floor will be found at the IPC/NPL Cleaning and Contamination Testing Center
CNC image measuring instrument is developed with advanced optical image, precise structure and fast data processing technology, which perfectly combines optical system and computer image processing system with 3D professional software processing
Application: 3D Vision Measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer
