Symbion P36 is an inline high-speed API solution that delivers 100% coverage for improving your product quality and boosting your productivity. Post-Paste AOI Instant Programming Easy Gerber Import 2D/3D Laser Path Superior POP™ D
ORPRO Vision SPI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion P36 Plus SPI system. For additional information, please contact ORPRO Vision at sales.us@orprovision.com sales.eu@orprovision
Industry Directory | Consultant / Service Provider / Manufacturer
A full service turnkey contract manufacturer. We have the capability to take your products from concept to reality. We utilize automated Surface Mount and Through Hole production lines.
Industry Directory | Manufacturer
Europlacer designs and manufactures a comprehensive range of highly flexible SMT pick and place equipment for the global electronics industry, with a network of distributors across the globe.
Manufacturers of high-tech products must rely on scalable and efficient tools to test their products for final acceptance. In a controlled cGMP (current Good Manufacturing Practices) environment, OEM�s must track specific attributes of their product
Industry News | 2021-12-13 20:10:54.0
As one of the power sources of manufacturing and production enterprises, compressed air requires continuous operation of equipment to ensure the stability of air supply pressure, which is also the basic condition of production and operation of enterprises. The air compressor unit, the main manufacturing equipment, is the core machine to undertake this task, and its continuous and reliable run ensures its own stable operation. Since it is a piece of running equipment, it needs a power supply to operate, large power consumption is the core of cost increase.
Industry News | 2015-10-06 19:39:34.0
JUKI released a space-saving compact PWB Inspection Machine "RV-2" at home and abroad in March 18. As a single-lane inspection machine, "RV-2" inherits the high-accuracy inspection capability of the high-end PWB Inspection Machine RV-1. This is an in-line type high-precision PWB inspection machine in space saving compact design.
Used SMT Equipment | Soldering - Reflow
Speedline Omni 7 Reflow Oven Model: Omni 7 Vintage: 2003 Warranty: 30 Days THE OMNIFLO Each OmniFlo model features the same design criteria and the same robust construction. Our central design theme is to minimize the number of parts in the
Industry News | 2016-10-28 02:55:27.0
Connect five PSE Power Supply Units to a single DME and work with up to 24 tools simultaneously.
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
