Industry News | 2021-10-28 21:21:44.0
A quote of a central air conditioner consists of the following prices: equipment (outdoor unit & indoor unit) + materials + installation cost + maintenance cost.
PanaCIM™ Enterprise Edition is a manufacturing execution system (MES) software solution offering new levels of capability across your entire enterprise. This portfolio integrates cooperating software products in a networked environment to solve key p
Career Center | Huntsville, Alabama USA | Purchasing
Strategic Supply Chain Manager Location: Central New York State Description: Multi-plant support for supplier price, delivery and quality. Develop/lead the corporate supply chain/commodity management team strategy. Manage long term business relati
Career Center | Charlotte, North Carolina USA | Accounting/Finance
General Ledger Analyst Will evaluate the current ERP capability at multiple sites and determine the ERP financials solution. Establish a centralized general ledger system for multiple sites. Administer the GL account maintenance for multiple sites
Career Center | Chicago, Illinois USA | Sales/Marketing
Vice President Sales � Midwest Leading manufacturer of micro- and nanofocus X-ray and CT systems and services seeks entrepreneurial sales executive to establish a regional sales office covering the Midwest/Central region. Candidates must have in-de
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
Used SMT Equipment | Soldering - Reflow
Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy. The vertical curing oven developed by Heller is available to replace the traditional
Used SMT Equipment | In-Circuit Testers
Yokogawa AQ7275 - 735032 AQ7275 OTDR 1310/1550nm, 34/32dB Yokogawa AQ7275 OTDR (735032) Improved Wavelength Quality Increase the efficiency of fiber installation & maintenance Improved waveform in Real-time mode Downstream measurement
Used SMT Equipment | In-Circuit Testers
Yokogawa AQ7275 - 735032 AQ7275 OTDR 1310/1550nm, 34/32dB Yokogawa AQ7275 OTDR (735032) Improved Wavelength Quality Increase the efficiency of fiber installation & maintenance Improved waveform in Real-time mode Downstream measurement
Industry Directory | Consultant / Service Provider / Manufacturer
A full service turnkey contract manufacturer. We have the capability to take your products from concept to reality. We utilize automated Surface Mount and Through Hole production lines.
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