Full Site - : ceramic balls in wave soldering (Page 5 of 7)

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Tue Jan 15 12:37:17 EST 2008 | gregoryyork

SORRY I did not offer a solution so here goes - The best way to get rid of this issue if you cant change flux is to reduce your flux consumption to a minimal with a spray flux and keep the heat REALLY high to boil off the alcohol before it can be abs

Why 50 mils in 0805 package instead of 40 mils.

Electronics Forum | Mon Oct 06 08:51:26 EDT 2003 | davef

The EIA does not provide that information. EIA standards focus on component dimensions. Alternately consider: ...cut... SM-782A - Surface Mount Design & Land Pattern Standard, Inc. Am. 1 & 2 ANSI Approved Get up-to-date land pattern recommendat

Step by step guide in evaluation of Solder Bar and Flux

Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef

Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella

When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so


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