Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
Electronics Forum | Sat Jun 19 00:49:17 EDT 2010 | mun4o
Hi all, lately ofen I have problem with cracked ceramic capacitors.We use 0805 and 0603 cap. Samsung.ICT measure diferent capacity of nominal.If I tray to desoldering component , then component cracked.I think , that the reason is the moisture in com
Electronics Forum | Fri Jun 25 05:34:40 EDT 2010 | ppcbs
Hi iv40 Try with NIC ceramic capacitor that was tested in wet process. We hav succeed with these cap after we found some failure with Kemet ceramic Cap which tested in dry test process while manufacturing.
Industry News | 2023-01-16 07:35:11.0
The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Technical Library | 2023-11-27 18:19:40.0
This page introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors). Major causes of solder cracks Solder cracks on MLCCs developed from severe usage conditions after going on the market and during manufacturing processes such as soldering. Applications and boards that specially require solder crack countermeasures Solder cracks occur mainly because of thermal fatigue due to thermal shock or temperature cycles or the use of lead-free solder, which is hard and fragile.
Technical Library | 2019-08-15 13:31:52.0
Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock has become a "pat" answer for all of these cracks, but about 75 to 80% originate from other sources. These sources include pick and place machine centering jaws, vacuum pick up bit, board depanelization, unwarping boards after soldering, test fixtures, connector insulation, final assembly, as well as defective components. Each source has a unique signature in the type of crack that it develops so that each can be identified as the source of error.
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/sonoscan-applications/microelectronics
: PEM-INST-001 ESA/SCC Spec No.25200 Ceramic Chip Capacitors Discoidals, Filters, MLCCs, etc. Mil-PRF-123, 31033 & 49470 Die Attach Mil-STD-883
| https://www.smtfactory.com/Introduction-of-Lyra-Reflow-Oven-s-process-development-stage-id3093448.html
I.C.T Team Global Partners SMT Line-Up SMT Production Line Full-auto SMT Line Semi-auto SMT Line Reflow Oven Pyxis Series Reflow Oven Lyra Series Reflow Oven S Series Reflow Oven L Series Reflow Oven LV
