ETA SMT Desktop PCBA Router ETA-100A If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB cutting machine,PCB cutter,PCB separator,PCB depane
Industry News | 2012-11-27 15:24:14.0
IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.
Industry News | 2012-08-28 09:54:11.0
Count On Tools Inc., announces a breakthrough in custom nozzle engineering for ultra-smooth components from the semiconductor market.
Industry News | 2023-01-16 07:35:11.0
The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.
Industry Directory | Manufacturer
OCTO, powered by CERcuits, provides ceramic PCB & substrates to the electronics industry. We develop and manufacture alumina PCB, aluminum nitride PCB, heat plates and other substrates. Get quotes & order online at our OCTO portal
表面镀层：表面镀层镀镍陶瓷镀层材料：65mm：层铜金属层厚度：75mm/75mm表面：浸金单/双面：双面镀铜通孔：阻焊层：否
1..精高，电热性能好，补充强度高。2。焊接性好，可实现盲孔通孔。3。技术完善，环保，无污染，成本训练培训技术。4。应用范围广，可5 。定制生产，无需开模，生产周期短。
Industry News | 2014-08-16 17:55:06.0
Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.
Technical Library | 2023-05-10 01:39:38.0
DPC (DirectPlatingCopper) thin film process is a method of prepare copper film using magnetron sputtering technology. This process is a process in which the copper target with the target material is placed in a true cavity chamber, and plasma is generated on the copper target surface by magnetron sputtering technology. The ions in the plasma are bombarded on the surface of the target, which is sputtered into fine particles and deposited on the substrate to form a copper film.
Industry Directory | Manufacturer
Manufacturers of Custom Thick Film Ceramic Substrates, Chip Resistors and Attenuators
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