Full Site - : ceramic substrates (Page 10 of 27)

Juki to Highlight FX-1RL at IPC Midwest 2008

Industry News | 2008-09-16 12:20:13.0

MORRISVILLE, NC - September 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will exhibit the FX-1RL High-speed Chip Shooter in booth 809 at the upcoming IPC Midwest exhibition and conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.

Juki Automation Systems

Juki to Feature FX-1R High-Speed Chip Shooter at APEX 2009

Industry News | 2009-03-24 12:59:22.0

MORRISVILLE, NC - March 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the FX-1R High-speed Chip Shooter in booth 759 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

Juki Automation Systems

New Yorker Electronics Releases New Series' of Exxelia Ohmcraft High Resistance Chip Resistors

Industry News | 2020-12-18 11:39:04.0

Ohmcraft High Resistance Chip Resistors Supply Ultra Precision, Thick-film High Ohmic Value and are used in Medical and Military Applications

New Yorker Electronics

NATEL and OnCore Renamed: NEO Tech

Industry News | 2015-06-11 19:47:33.0

NATEL Engineering Company and OnCore Manufacturing announced today that the merged company will be named: NEO Technology Solutions (NEO Tech). The name NEO Tech captures and combines the company’s legacy members; NATEL Engineering, EPIC Technologies, and OnCore Manufacturing, while creating a name on which to build a brand.

NEO Technology Solutions (NEO Tech)

NATEL and OnCore Renamed: NEO Tech

Industry News | 2015-06-12 11:41:24.0

CHATSWORTH, CA – May 18, 2015 – NATEL Engineering Company, Inc. and OnCore Manufacturing, LLC announced today that the merged company will be named: NEO Technology Solutions (NEO Tech). The name NEO Tech captures and combines the company’s legacy members; NATEL Engineering, EPIC Technologies, and OnCore Manufacturing, while creating a name on which to build a brand.

Oncore Manufacturing Services (NEO Tech)

VPG Foil Resistors Ultra-High Precision Molded Surface Mount Resistor Features Z1 Foil Technology

Industry News | 2021-05-11 14:58:49.0

Z1 Foil Technology improves overall environmental performances and long-term stability

New Yorker Electronics

New Vishay Dale Thin Film Wraparound Chip Resistor is released by New Yorker Electronics

Industry News | 2021-09-15 10:52:35.0

Vishay Precision Performance Resistor Series Significantly Reduces Board Space and Component Counts by Replacing Larger Resistors

New Yorker Electronics

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Industry News | 2007-11-08 21:34:39.0

Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

i3 Electronics

Princeton Technology

Industry Directory | Manufacturer

Electronic PCB design, fabrication, and assembly for both plated through hole and SMT

West-Tech Materials

Industry Directory | Manufacturer's Representative

Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi


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