Applied Ceramics is a fabricator of custom-made ceramics, quartz, silicon and sapphire spare parts designed for the semiconductor industry.
Industry Directory | Manufacturer
Pantronix offers a large array of standard and customized semiconductor and photonic packaging. These include: Hi-Rel & Custom Ceramic Packaging, Memory Modules, Optical Devices, Plastic Packaging, and Photonic Packaging.
New Equipment | Rework & Repair Services
BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Streamtek Electronis provides HHL Package with glass seal and ceramic seal for the applications of high power laser diodes Full solutions of HiRel Hermetic packages such HHL Package with Ceramic feedthrough; 2pin package with ceramic feedthrough; But
Electronics Forum | Wed Aug 20 10:27:25 EDT 2003 | Dan Gosselin
Do any of you guys have a list of parts that cannot survive hanging upside down during reflow soldering. As our board designs become increasingly dense and higher speed, we need to use all available pcb real estate. This means locating parts we hi
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Used SMT Equipment | Pick and Place/Feeders
Panasonic CM602-L high-speed module placement machine, CM602-L placement machine not only follows the original module of Panasonic CM402, but also adds 12 nozzle high-speed head and direct suction tray as needed. The function of the original 8 nozzle
Used SMT Equipment | Pick and Place/Feeders
Panasonic CM602-L high-speed module placement machine, CM602-L placement machine not only follows the original module of Panasonic CM402, but also adds 12 nozzle high-speed head and direct suction tray as needed. The function of the original 8 nozzle
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Parts & Supplies | Component Packaging
Hitachi HV15C Nozzle Wholesale Large Stock Place of Origin China( Mainland ) P/N HV15C Material Ceramic zoey@jinchensmt.com
Parts & Supplies | Component Packaging
Specifications 1.Model MIRAE A B C D 2.For mounting machine 3.Accurate durable 4.Tip by Tungsten steel 5.Abnormal type is available 21003-61290 A-S02 φ0.45/φ0.25 CERAMIC NOZZLE 21003-61090 A-TYPE φ0.65/φ0.40 CERAMIC NOZZLE 21003-62090 B-TYP
Technical Library | 2019-06-05 11:11:06.0
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Dennis Odonnell , Vice President of Precision PCB Services, Inc., Oroville CA Explains How to Evaluate a BGA Rework Station ! #BGA Rework Stations http://www.pcb-repair.com/bga-rework-station/
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
| http://www.thebranfordgroup.com/dnn3/Auctions/RecentAuctions.aspx
Jabil Marcianise / Wuhan [Online] SOLD - Auction Closed on 8/12/2021 (2) Surplus Packages of Test & Measurement Equipment Oscilloscopes, Multimeters, Network Testers & More! Marcianise, Italy: (1,000+) Pieces of ETM Equipment Wuhan, China: (20+) Pieces
