Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2012-05-15 10:31:04.0
IPC Midwest will highlight the new technologies, materials and processes in electronics manufacturing to help engineers solve their challenges and work smarter.
Industry News | 2016-04-13 16:56:22.0
The SMTA Capital Chapter is pleased to announce it will welcome Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd to instruct a tutorial on SMT Principles at Zentech Manufacturing an ITAR facility located at 6980 Tudsbury Road, Baltimore, MD, 21244. The tutorial is scheduled from 8:30 am to 4:00 pm and includes lunch and a tour. As Zentech is an ITAR facility only US Citizens can participate in the tour. This tutorial is designed for those involved in printed board design, bare board fabrication, SMT assembly, quality control, materials purchasing, and reliability testing. New this year! Get a $20 EARLY BIRD discount on regular member and non-member registrations if registration is completed by midnight on April 30, 2016. Registration is required for this learning event.
Industry News | 2017-07-27 19:01:34.0
The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2018-06-04 18:00:34.0
If your company has e-textiles and/or stretchable technologies on its roadmap and you find yourself asking the question, “How can I merge smart fabrics with smart engineering?” IPC has developed a technical and business education workshop to answer these questions and more. IPC E-Textiles 2018 will take place on September 13, 2018 in Des Plaines, Ill., and will bring together innovators, technologists and engineers to collaborate, and identify partners and solutions to propel growth for the e-textiles market.
Industry News | 2018-09-26 11:45:32.0
On September 13, representatives from the e-textiles ecosystem, including product innovators, material suppliers, electrical engineers and academia, came together for IPC E-Textiles 2018, a first-time e-textiles event for IPC. The workshop was developed by leaders from the e-textiles supply chain, who approached IPC to host a collaborative educational event for two converging industries—textiles and electronics.
Industry News | 2020-03-18 19:17:38.0
Clariant's Additives business and Floreon-Transforming Packaging Limited announce an exciting new collaboration to further extend the performance properties and market potential of biopolymers, whilst preserving their environmental benefits.
Industry News | 2024-03-11 14:58:44.0
New this year, student scholarship awarded by IPC Education Foundation
