Electronics Forum | Thu Jul 21 19:53:20 EDT 2011 | isd_jwendell
Using AIM N.C. paste, just ran 10 panels to test after applying Rain-X to the stencil (pre-clean with IPA). Printing and release were slightly better (maybe my imagination), but not a large difference. Stencil remained cleaner longer. I could not tel
Electronics Forum | Thu Sep 17 15:21:50 EDT 2020 | lpbro
For height, I start +-2mil usually. For 3mil stencils, my lower limit starts at 1.5mil, upper is 5. If the area is chem ethed, I normally add .5 to the stencil height. My default volume is 60 - 160%. Then print specs are adjusted till I see fit, then
Electronics Forum | Thu May 04 11:37:25 EDT 2023 | proceng1
Thank you. I do feel that the document is very lacking in detail. It mostly says "yes, it needs cleaned. Make sure the cleaning process doesn't screw it up". The majority of boards that get wiped are already populated on the other side. So that lim
Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se
| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We
Electronics Forum | Thu Aug 12 22:38:44 EDT 1999 | Dave F
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
Electronics Forum | Tue Feb 23 09:51:35 EST 1999 | Steve Schrader
| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with
Electronics Forum | Wed Jul 01 03:05:56 EDT 1998 | Jon Gruett
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Thu Nov 16 06:13:16 EST 2000 | Adam Seychell
I am currently building a home PCB etching tank based on the ammonia/ammonium sulfate chemistry. The etching system consists of a etching tank, and an electrolytic copper recovery tank. The result is a infinitely replenishable etching system without
Electronics Forum | Fri Mar 23 21:36:02 EST 2001 | CAL
If you do not have any luck finding a west coast lab, but need services I am sure we can help. The only problem is we are on the east coast. Many moons ago empf was on the west coast (China Lake) but moved eastward. We are in Philadelphia, PA. (ski
Electronics Forum | Fri Aug 13 12:52:17 EDT 1999 | Steve Schrader
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
