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Re: electroformed stencils

Electronics Forum | Thu Jun 03 18:00:33 EDT 1999 | John Thorup

.020" pitch spacing. Which have yielded my process excelent results. | | My main stencil supplier is I-Source in Irvine, CA and has pretty much standardized on 100% lazer cut stencils for competetive pricing. | | Hope this helps. | | | | Deon Nunga

QFP solder paste volume

Electronics Forum | Fri May 21 15:50:41 EDT 1999 | John Thorup

We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendors

Re: Screen printing the board from........

Electronics Forum | Thu Mar 05 23:33:53 EST 1998 | Ron Costa

| | Hello everyone! | | Does any know anything about bare board size variations? | | Is there a spec. or tolerance? | | I'm running small lots of boards and during the screen printing process | | I find that I cannot paste each board perfectly.I've t

Austin American Microjet Users

Electronics Forum | Wed Jun 04 14:33:28 EDT 2003 | joeherz

CAL, Thanks for the input. When I said chemistry I was refering to soldering chemistry and not cleaning. I believe this machine has the capability to incorporate a saponifier but would prefer not to run in this manner. Running a closed loop DI re

Replacement for nitrogen in the reflow oven

Electronics Forum | Fri May 21 20:38:40 EDT 2004 | Grant Petty

Hi, This would be a very exciting idea. Nitrogen is an inert gas, so this is why it's used, however Hydrogen mixed with oxygen in normal air is highly explosive, so it would be one of the worst gasses to use in a reflow oven I would think. Remember

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 02:22:08 EDT 2005 | grantp

Hi, There are a number of things you can try. You are already using 1:1 hole to pad ratio, and that's good as you need the size. I would try an electroform stencil as that will have a smooth side of the aperture and help paste release. Don't use c

Fine Pitch Stencil Design

Electronics Forum | Thu Dec 08 08:22:58 EST 2005 | grantp

Hi, How fine pitch are you going? What kind of stencil printer are you using? We had a manual stencil printer and needed to print 1-mm pitch BGA and needed to go to laster cut and electro polish at 4 thou to get good paste release. We also went 1:1

0402 aperture design lf

Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc

There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t

Soldering problem with Au plating PCB

Electronics Forum | Mon Apr 06 11:58:42 EDT 2009 | c111

Jeong Ju-young You touched them all up with an iron? Wow! We have also had similar issues. What I did to prove there was a board problem was paste one & reflow one bare board with the same chem (noclean) we saw the non-wetting condition. Then applied

Re: screen printer and stencil printer

Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se

| | | Hi, | | | I'd like to ask some tips about the merits and shortcomings o | | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | | application? | | | The board


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