Electronics Forum | Wed Jul 01 03:05:56 EDT 1998 | Jon Gruett
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Mon Jun 29 13:51:29 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Mon Jun 29 13:50:48 EDT 1998 | Russ Miculich
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Thu Mar 05 23:52:26 EST 1998 | Ron Costa
| Hi Ron, | Your question really opens up a "Pandora's box", but when you say you're not able to print perfectly, what is it exactly that you mean? Is the print lacking volume? Is it mis-registered? Are you bridging? Also, what printers have you used
Electronics Forum | Fri Jul 10 13:16:27 EDT 1998 | Bill Schreiber
To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating capibil
Electronics Forum | Mon Jul 20 23:40:31 EDT 1998 | Alex Ondi
| To electropolish or not to nickel plate, that is the question. Whether it be nobler in the minds of the competition could be the answer. | I think it will probably depend upon whom you ask the question. If the stencil mfgr. has nichel plating cap
Electronics Forum | Wed Sep 22 21:12:16 EDT 1999 | se
| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu
Electronics Forum | Wed Sep 22 22:23:55 EDT 1999 | SY
| | | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | | | thanks | | | | | | | | | We use 6
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
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