Used SMT Equipment | Board Cleaners
Make: Speedline Model: Aquastorm 200 Vintage: 2008 Details: • 24” Conveyor Width • Chemical Isolation Package • Interior Lighting • 2 Additional E-Stops • Auto Standby Photocell • 30” Entrance Inclin
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-09-27 09:14:41.0
One of the most critical factors in preventing corrosion from occurring in electronics is maintaining the state of cleanliness. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1] So, to prevent corrosion from occurring, either the material or the chemical environment must be adjusted. Adjusting the material usually means application of a protective coating or replacing a more reactive material with a less reactive material. Adjusting the chemical environment usually means removing ionic species through cleaning, and removing moisture, usually with a conformal coating or hermetic package. Ionic species and moisture are problematic because they form an electrolyte which is able to conduct ions and electricity. Any metal that comes into contact with the electrolyte can begin to corrode.
Events Calendar | Wed Feb 20 00:00:00 EST 2019 - Wed Feb 20 00:00:00 EST 2019 | ,
Wisdom Wednesday Webinar: Highlights of IPC’s 2018 PCB Technology Trends Study
Humitector™ Type 2 Humidity Indicator Card, used together with a Desi Pak® desiccant, can help provide a complete history of a dry pack environment for moisture sensitive surface mount devices (SMD's) (MSD - moisture sensitive
Used SMT Equipment | Board Cleaners
Austin American Hydrojet In Line Cleaner For Sale 3 identical units available Year 2003 Just taken offline in Good Working Condition Quantity Discounts Available Product Features 24" Width Conveyor Belt Dimensions: 17' x 6' x
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
1.Characteristic: 1.Highly effective recycling of the solder waste, up to 93% yield . 2.No need to add any chemicals or reducers to the process uses physical separation to ensure a good quality product. 3.Button controls, digital temperature contr
1.Characteristic: 1.Highly effective recycling of the solder waste, up to 93% yield . 2.No need to add any chemicals or reducers to the process uses physical separation to ensure a good quality product. 3.Button controls, digital temperature contr
