Industry Directory | Manufacturer
A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.
Industry Directory | Manufacturer
Manufacturer of high performance, alternative cleaning agents. Petroferm Provides products to most cleaning process technologies; aqueous, co-solvent, hydrocarbon/solvent, semi-aqueous, and vapor degreasing.
New Equipment | Cleaning Agents
440-R® SMT Detergent is the only stencil-cleaning chemistry verified by the U.S. EPA for specific parameters of environmental safety, user safety and cleaning efficiency and is the only stencil-cleaning chemistry to "survive the test of time". 440-R
New Equipment | Cleaning Agents
Advanced Packaging Cleaning Chemistry AQUANOX® A4638 is an engineered electronic assembly and advanced packaging cleaning agent designed to remove flux residue from flip chip and low clearance components. AQUANOX® A4638 is designed to remove water s
Electronics Forum | Thu Jun 24 11:44:20 EDT 1999 | Matt Stump
I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. Any suggestions?
Electronics Forum | Mon Aug 06 12:14:35 EDT 2001 | seand
Hello All, The audacity to yell Smartsonic here is appauling. This is a process approach dependent on the type of epoxy. To suggest your equipment without knowing a thing about the process is shameless. OK, now I'll get off my soap box. The low
Used SMT Equipment | Board Cleaners
Austin American Hydrojet In Line Cleaner For Sale 3 identical units available Year 2003 Just taken offline in Good Working Condition Quantity Discounts Available Product Features 24" Width Conveyor Belt Dimensions: 17' x 6' x
Used SMT Equipment | Coating and Encapsulation
Ultrasonic Systems Inc (USI) Prism 450 Conformal Coater Model: P450-1-161 Vintage: 2007 Four (4) valves included, two(2) ultrasonic valves mounted in machine - with tilt axis, two(2) more fine line valves included ( new ) - see photos
Industry News | 2003-06-04 08:27:58.0
DuPont cites rising raw material, transportation and energy costs as reasons for the increase.
Industry News | 2019-07-18 08:59:12.0
KYZEN will exhibit at the SMTA Queretaro Expo & Tech Forum, scheduled to take place Thursday, August 15, 2019 at the Misión Grand Juriquilla in Queretaro, Mexico. KYZEN cleaning experts will offer one-on-one cleaning assessments and discuss the new AQUANOX® A4727 Next Generation Aqueous Assembly Cleaner.
Technical Library | 2021-05-26 00:53:26.0
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
HD footage of the Technical Devices Company's Flood Box in operation on a Nu/Clean 800 Series Inline Cleaner
Events Calendar | Fri Mar 27 00:00:00 EDT 2020 - Fri Mar 27 00:00:00 EDT 2020 | ,
Optimizing Conformal Coating Coverage for Improved Environmental Corrosion Protection - Free Webinar
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Taoyuan City,
SMTA Taiwan Tech Forum 2024
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R
Career Center | , Texas | Human Resources,Maintenance,Management,Technical Support
Over 17 years in the training and development industry.� I have a track record of successes in designing strategic programs that address organizational skill gaps and business initiatives. Being an expert in Instructional Systems Design (ISD) I have
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Component Handling Mumtaz Bora Free! 2009 Methods for Reworking Leadless Packages - LGA, QFNs and More Bob Wettermann and Ray Cirimele Free! 2009 Why Switch From Pure DI-Water To Chemistry? Naveen Ravindran, M.S.Chem.Eng. Free! 2009 Process
GPD Global | https://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf
. Polycarbonate and silicones are widely used, with the polymer acting as a binder to keep the phosphor in place. The high- viscosity liquid slurry is dispensed on to pump LED chips resting in their packages, using precision dispensing machines (see figure 2
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