Industry Directory: chip (293)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

Precision PCB Services, Inc

Precision PCB Services, Inc

Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

New SMT Equipment: chip (536)

Chip Quik SMD Rework Products

Chip Quik SMD Rework Products

New Equipment | Rework & Repair Equipment

We are a distributor of Chip Quik SMD rework products. Call for pricing or check out our on line store:  https://youtu.be/DBJ1MxqD3d0 (888) 406-2830

Precision PCB Services, Inc

JUKI RX-7R Pick and Place Machine

JUKI RX-7R Pick and Place Machine

New Equipment | Pick & Place

JUKI RX-7R Pick and Place Machine Applicable Components: 03015 chip ~ 25mm square elementBoard size:510mm×450mmFeeder inputs:max 76placement capacity:75,000CPHProduct description: JUKI RX-7R Modular Pick and Place Machine,Applicable Components: 0301

Qersa Technology Co.,ltd

Electronics Forum: chip (2602)

chip shooter

Electronics Forum | Tue Apr 13 20:08:15 EDT 1999 | Jeff Jones

I am begining to evaluate hi speed chip shooters. We are interested in the Panasonic MV2E. Does anyone have any experience with the turret style placement equipment, Panisonic in particular. Thanks, Jeff

chip mounters

Electronics Forum | Fri Jan 21 02:07:16 EST 2011 | obrant

I'm looking for good/clean used chip mounters. juki ke760 yamaha yg100xg panasonic cm202 fuji kikai cp7, 8, 9

Used SMT Equipment: chip (2845)

Juki FX-1R Chip Shooter

Juki FX-1R Chip Shooter

Used SMT Equipment | Chipshooters / Chip Mounters

Juki FX-1R Pick & Place Machine, Chip Shooter: high Speed Modular Mounter FX, 33,000 CPH, Located In Fremont, CA An auction item: bidding on this listing starts on Wednesday, September 20, 2017 6:00:00 AM

Baja Bid

Quad IVC

Quad IVC

Used SMT Equipment | Chipshooters / Chip Mounters

Quad IVC Pick and Place Location: San Antonio, TX S/N:2383

Baja Bid

Industry News: chip (1683)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Kit Checks Out Pick-and-Place Equipment

Industry News | 2003-06-18 07:56:46.0

The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.

SMTnet

Parts & Supplies: chip (5298)

Yamaha YV100X YAMAHA multi-functional chip mounter

Yamaha YV100X YAMAHA multi-functional chip mounter

Parts & Supplies | Assembly Accessories

Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X  substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki FF12MM CHIP MOUNTER FEEDER

Juki FF12MM CHIP MOUNTER FEEDER

Parts & Supplies | Chipshooters / Chip Mounters

SMT JUKI FF12MM CHIP MOUNTER FEEDER More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: chip (116)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

Videos: chip (363)

YS-IH882 with Empty chip detection

YS-IH882 with Empty chip detection

Videos

Broader scope, the latest ultra-small SMD components (01005) count, the series is as follows:  These are the components package specifications.  Functions:  1, Empty chip detection capabilities SMD chip counter, the job is simple, positive and neg

Qinyi Electronics Co.,Ltd

Hot Sale automatic pcb bar board push up stacker smt destacker used in chip mounter Assembly Line

Hot Sale automatic pcb bar board push up stacker smt destacker used in chip mounter Assembly Line

Videos

Hot Sale pcb Push-up stacker for chip mounter Assembly Line Product introduction: 1.This equipment is used to collect bare PCBs at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control

Shenzhen Honreal Technology Co.,Ltd

Training Courses: chip (56)

IPC-7711/7721 Specialist (CIS) Recertification Course

Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.

The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.

Blackfox Training Institute, LLC

IPC-7711/7721 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-7711/7721 Trainer (CIT)

The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: chip (20)

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,

Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC)

Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA

International Wafer-Level Packaging Conference (IWLPC)

Surface Mount Technology Association (SMTA)

Career Center - Jobs: chip (40)

CSP/BGA Applications Engineer

Career Center | , | Engineering

A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment

Eden Associates

SMT Engineer

Career Center | , New Jersey USA | Engineering

Process Engineers SMT- Knowledge of all SMT lines. Flip Chip, BGA, experience. Skilled in Solder Paste, Pick and Place, Reflow and BGA rework equipment. Develop and analyze complex designs and develop specs and procedures

Circuit Search

Career Center - Resumes: chip (65)

SMT equipment eng

Career Center | seoul, South Korea | Engineering

I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .

SMT ENGINEER/TECHNICIAN

Career Center | Cebu, Philippines | Engineering,Maintenance,Technical Support

Experience SMT machine maintenance and SMT process from raw materials to finish goods

Express Newsletter: chip (364)

SMTnet Express - November 15, 2018

SMTnet Express, November 15, 2018, Subscribers: 31,472, Companies: 11,088, Users: 25,406 Status and Outlooks of Flip Chip Technology John H. Lau; ASM Pacific Technology Status of flip chip technology such as wafer bumping, package substrate, flip

Partner Websites: chip (4167)

Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component

KingFei SMT Tech | http://www.smtspare-parts.com/sale-9401138-panasonic-hdp-chip-glue-dispensing-nozzle-2d2s-chip-nozzle-for-1608mm-component.html

Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech

Hitachi chip mounter sigma-G5S

| https://www.hitachi-feeder.com/sale-9839690-hitachi-chip-mounter-sigma-g5s.html

Hitachi chip mounter sigma-G5S WELCOME TO SHENZHEN ZHI HONGLAI TRADING CO.,LTD Sales & Support Request A Quote - Email Select Language English Home Products About Us Factory Tour Quality Control Contact Us Request A Quote All Categories Universal Instrument (UIC


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