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HCT-1200-SV Automatic LED Pick and Place Machinefor LED PCB SMT Assembly

HCT-1200-SV Automatic LED Pick and Place Machinefor LED PCB SMT Assembly

New Equipment | Pick & Place

Offering HCT-1200-SV full automatic LED Pick and Place Machine / SMD LED Placement Machine. * Placement rate (optimized) 40,000CPH * 8 placement heads * Maximum PCB size 1200×380mm * Placement accuracy: ±0.05mm * Component range: 0603~5

Shenzhen HanChengTong Technology Co.,Ltd

SMT 256B Solder Joint Encapsulant

SMT 256B Solder Joint Encapsulant

New Equipment | Materials

SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes

YINCAE Advanced Materials, LLC.

SMT 266 Solder Joint Encapsulant

SMT 266 Solder Joint Encapsulant

New Equipment | Materials

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat

YINCAE Advanced Materials, LLC.

Peel Force Tester

Peel Force Tester

New Equipment | Tape and Reel Equipment

Peel Force Tester Model: PL425 Specification: Peel angel: 165-180 degree Pull length: 50-200mm Japan ALGOL electronic Rally: display range MAX 1000.0 gf. Test speed: Max 300mm / min Power: single-phase AC 110V / AC 220V. Dimensions (mm): Le

Plastlist Group

DFPIC165X - High Performance 8-bit RISC Microcontroller, ultimate low power consumption

New Equipment | Other

Overview • up to 33 instructions • 2 times faster compared to original implementation • power saving SLEEP mode The DFPIC165X is a low-cost, high performance, 8-bit, fully static soft IP Core, intended to operate with fast memory (typically

Digital Core Design

SuperPro 611S

SuperPro 611S

New Equipment | Other

Ecomomy Universal Programmer Universal 48-pin driver supports today's most complex devices Improved programming processor for high-speed programming Programs devices with Vcc as low as 1.2V In-system programming (ISP / ICP) capability Programm

Xeltek Inc

SuperPro 610P

SuperPro 610P

New Equipment | Other

Ecomomy Universal Programmer Expanded Features Universal 48-pin driver supports today's most complex devices Improved programming processor for high-speed programming Programs devices with Vcc as low as 1.2V In-system programming

Xeltek Inc

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West

Industry News | 2013-06-10 12:23:05.0

Kyzen will showcase AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in Booth #5547 in the North Hall at the 2013 SEMICON West exhibition & conference, July 9-11, 2013 at the Moscone Center in San Francisco, CA.

KYZEN Corporation

Practical Components to Debut New Test Board for 0.33 mm Dummy CVBGA Test Vehicle at the IPC APEX Expo

Industry News | 2012-02-03 13:29:38.0

Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #538 at the upcoming IPC APEX Expo.

Practical Components, Inc.


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