Electronics Forum | Tue Jan 20 13:33:14 EST 1998 | Justin Medernach
| This is a re-post of my previous message. I typed my Email address wrong in the other message. I am sorry for any inconvenience caused. | Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thi
Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker
If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need
Electronics Forum | Tue Apr 30 07:49:38 EDT 2002 | johnw
shawn, define what you mean by solder ball's scattered across the board? I'd tend to agree with the thoughts of too much paste on chip's but normally your ball's would be mainly around these devices although som can move around depending on the surf
Electronics Forum | Mon Feb 10 09:49:32 EST 2003 | pjc
For manual X-ray systems: Kv power to start off with. Depending on what type of components you have to X-ray, you may be ok w/ just a 90Kv system, for example. Its not all about Kv though. With most systems you can adjust to quantity of X-rays you ar
Electronics Forum | Fri Aug 08 18:00:34 EDT 2003 | kenBliss
Hi Bman At the risk of coming off as a �sales type�, you appear to be looking for a solution provider and probably opinions on your ideas. Regarding your method mentioned, This is not the most efficient way to run a stockroom but will work and will
Electronics Forum | Thu Apr 29 10:35:31 EDT 2004 | dougt
Start with a load cell (force sensor), you will need one that can handle the force range you will be placing. Someone please correct me on this if I'm wrong but I seem to recall that placement force runs in the range of a couple hundred grams. Chec
Electronics Forum | Fri Jul 24 13:41:05 EDT 1998 | Bob Willis
Sorry guys have a look at this list of component weights and then work out the surface area of the lead/pad and then come back on the PLCC issue. Chip 0805���� 0.007g������ 2 Chip 1206���� 0.009g���� 2 Chip 1210���� 0.012g���� 2 SOT23���������0.008g�
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Fri May 26 21:25:52 EDT 2006 | mika
Yes we do place "big and heavy" SMT DC/DC:s on most of our board's. Please tell us what brand it is or at least what the package look like?!? For instance we place a different numbers of "heavy" DC/DC converters (40x20mm & 45x25mm) that has the pick-
Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon
| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?
