130kV, 5 Micron Microfocus X-Ray Inspection System The X-SCOPE 6000 is digitally full programmable CNC controlled x-ray inspection system that allows operators to program inspection and measurement routines with point and click ease. Standard featu
Long Foam Cutting Tools EPS Milling Router Bits Ballnose Flat End and Conical These big long series foam end mill, ball nose and conical router bits are widely used with robot milling machine and huge CNC router which used to cut molds from EPS foa
Parts & Supplies | Pick and Place/Feeders
N510058948AA Panasonic Dispenser Head Ball Spline Part Name: Ball spline Part number:N510058948AA Use for:Dispenser Head-N610157748AA NPM Model:LT4XCSS+101L-(A)(12600877X000) Condition:original new Inventory: N610157748AA DISPENSER HEAD
Conexant Systems Inc.
Industry News | 2009-04-23 20:46:52.0
FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.
Industry News | 2016-02-06 00:54:37.0
Barry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5mm high temperature co-fired ceramic (HTCC) quad-flat-no-leads (QFN) package to 40GHz. Barry Industries is an ISO9001:2008 certified ITAR-registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
Industry News | 2016-02-06 00:54:38.0
Barry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5mm high temperature co-fired ceramic (HTCC) quad-flat-no-leads (QFN) package to 40GHz. Barry Industries is an ISO9001:2008 certified ITAR-registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
Industry News | 2009-08-10 20:22:02.0
2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.
Industry News | 2011-03-10 21:20:06.0
Juki Corporation will showcase its latest assembly systems in Booth #1559 at the upcoming IPC APEX EXPO.
Industry News | 2021-05-21 14:09:53.0
Gowanda's Space/Aero Chip Inductors provide Lower Power Consumption in High Frequency Applications
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