Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic: Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Used SMT Equipment | SMT Equipment
Product name: KE - 3010 A high-speed chip mounter Product number: KE – 3010A Detailed product introduction Characteristic: Constantly improve the KE series products. So as to realize the high speed high quality electric production line of flexib
Used SMT Equipment | SMT Equipment
Product name: YS100 high speed universal module chip mounter Product number: YS100 Products in detail The characteristics of 25000 CPH (equivalent to 0.14 seconds/CHIP: best conditions) ability of high speed SMT All the time, SMT absolute a
Used SMT Equipment | SMT Equipment
Product name: KE - 2070 high-speed chip mounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placement machine of small components. Not only the element corresponding to a wide range of laser recogniti
Used SMT Equipment | SMT Equipment
Product name: KE - 2080 high-speed chip mounter Product number: KE - 2080 Detailed product introduction Characteristic: Small components of high speed SMT capacity and IC or complex shape abnormity components of high precision SMT ability and g
Used SMT Equipment | SMT Equipment
Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo
Used SMT Equipment | SMT Equipment
Product Name: FX-2 high speed modular chip mounter Product number: FX-2 Detailed product introduction Characteristic: Mount work efficiency is increased by 20%, *1 at the same time to make economic benefits, operating performance, reliability of
Used SMT Equipment | SMT Equipment
Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo
Used SMT Equipment | SMT Equipment
Product name: YV100XGP YAMAHA chip mounter at a moderate speed Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XGP High speed and high precision multi-function modular placement machine 0.18 seconds/
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XGP High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ultra-high-speed SMT(best conditions) 16200 CPH (grain per hour)