Parts & Supplies | Chipshooters / Chip Mounters
There is stock for sale. If you are interested, please contact us for a quotation by email. Email: info@qosmt.com
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Volterra designs, develops, and markets leading edge silicon solutions for low-voltage power delivery. The Company's product portfolio is focused on advanced switching regulators for the computer, broadband communication, networking, and portable w
Industry Directory | Manufacturer
The automation company that produce QFP/BGA mounter with competitive price in Taiwan.
Industry Directory | Manufacturer
Own design & production from DFB LD chip, passive components, modules and rackmount type in optic and data market.
Industry Directory | Manufacturer
ROBOTHERM is an engineering and manufacturing company specialized in the field of semiconductor, smart cards, C.O.B (Chip on Board), C.O.F (Chip on Flex), S.M.T (Surface Mounted Technology) and hybrids applications.
New Equipment | Test Equipment
iCT7000™ is ideal for electronics assembly manufacturers that require high throughput, test accuracy and proven reliability at lower test costs. The InCircuit Scorpion is a small footprint in-circuit tester that can be configured with up to 2048 all-
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
Used SMT Equipment | Pick and Place/Feeders
Make: ASMModel:ASM SIPLACE CA Details:1. High-Speed Placement CapabilitySMT component placement speed up to 76,000 components per hour (Cph).Flip chip placement from wafer up to 40,000 Cph.Die attach placement from wafer up to 50,000 Cph. 2. Placemen
