Parts & Supplies | Pick and Place/Feeders
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Industry News | 2011-03-21 13:35:30.0
JEDEC Solid State Technology Association announced a broad spectrum of ongoing standards development work related to 3D-ICs.
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000
Industry News | 2017-05-03 21:11:11.0
StratEdge Corporation announces the opening of its Amazon Store to sell its off-the-shelf high-frequency packages.
Industry News | 2018-12-05 22:38:32.0
Allchips has reached strategic cooperation with China Mobile, to promote the development of IoT in China. Along with the rapid development of China’s ecosystem and science & technology, the Internet of things has gradually entered into all fields of society, the global Internet of things market is expected to reach 830 billion dollars in 2020, the number of IoT devices will reach 50 billion.
Industry News | 2020-09-23 11:45:08.0
Amkor Technology invites you to join us at the FREE Electronic Design Process Symposium (EDPS) virtual event September 30-October 1, 2020. EDPS is the leading forum for advanced chip and systems design processes. Amkor's Gerard John, Sr. Director, FCBGA, will present "Using Machine Learning to Optimize Semiconductor Test" on October 1st at 5:50 PM PST.? Abstract: Machine learning (ML) is a field of engineering under the artificial intelligence (AI) umbrella, based on the idea that systems can learn from data, identify patterns and make decisions with minimal human intervention. ML is often used as a prediction tool to perform analysis on large amounts of data, automate analytical model building and provide the user (human, machine or calling function) with event occurrence probability. To date, the test community has not embraced ML and continues to look at ML with skepticism when approached with the paradigm shift - replacing conventional product test suites with a test suite selected by an ML algorithm. This skepticism may be the result of multiple factors, such as limited familiarity with ML, partial awareness of its capabilities, lack of tools that can be easily used and the workload involved in the process of training a machine to discern data. In addition, by running a compressed test suite suggested by ML, questions arise about test escapees and their potential impact on product quality. This talk uses the example of an Open-Short test to shed light on optimizing semiconductor test using ML. For more information and to register for this FREE event, visit the EDPS website
Industry News | 2012-07-26 10:14:10.0
SIPLACE Grand Opening in Atlanta
Industry News | 2008-06-19 11:24:03.0
MicroMaster gives circuit board designers and manufacturing engineers functional test and diagnostic capabilities
Industry News | 2012-02-07 16:16:09.0
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.