Electronics Forum | Wed Jun 23 18:23:32 EDT 1999 | Tom B.
Even though you may find a pad-pad thru-hole spacing, part body size, orientation, and insertion head tooling clearences may be the deciding factor in spacing. 1. Part body diameter will dictate component centroid spacing. ---[][][][
Electronics Forum | Tue Aug 25 20:44:16 EDT 1998 | Peter
We haven't built these yet. The customer was in layout at the time and I was looking for any flags from others to determine if I should have them change the layout as I've not seen this before. From your response and others that I've received, it s
Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
Electronics Forum | Thu Aug 20 15:29:45 EDT 1998 | D. Lange
Re: Questions #2 Are you having solderability problems with that arrangement? Sounds like problems could be solved at the wave solder. If the customer has already spun pcb then sometimes for low volume it would be easier to correct the problem at wa
Electronics Forum | Wed May 26 15:56:08 EDT 1999 | Chrys Shea
| | | we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any
Electronics Forum | Mon Jun 14 23:02:14 EDT 2004 | Rodion Pronin
Hello! My name is Rodion Pronin and I represent research oriented software company Asprosft located in Toronto, Canada. One of our recent projects were developing a optimization engine for pcb assembly. That is, given the machine capabilities and c
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Fri Apr 23 12:10:41 EDT 1999 | Dave F
| A customer told me that pad geometry was to be different depending on soldering process. | | I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should
Electronics Forum | Fri Jun 17 16:15:41 EDT 2011 | rway
One problem you may have with deeper scoring is not so much broads breaking apart unintentionally, but warping upstream while on the SMT line which can cause sagging. This may give you transport issues from one machine to another, and if you have an
Electronics Forum | Fri Jun 21 10:22:13 EDT 2002 | russ
A lot of your success with waving SMT components is dependent upon design and what type of wave forms you use. Without knowing how the board is laid out or what type of wave you have it is pretty difficult to determine what the yield differences wil
