Electronics Forum | Thu Apr 30 20:41:52 EDT 1998 | Dave
| We would like to add another pick and place machine to | the SMT line. We're low volume so we change the line over | after each group of boards. So far we've pretty much | ruled out Siplace in favor of the Universal machines. | Does anyone care to
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Fri Jul 24 13:41:05 EDT 1998 | Bob Willis
Sorry guys have a look at this list of component weights and then work out the surface area of the lead/pad and then come back on the PLCC issue. Chip 0805���� 0.007g������ 2 Chip 1206���� 0.009g���� 2 Chip 1210���� 0.012g���� 2 SOT23���������0.008g�
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Electronics Forum | Tue Nov 06 10:28:58 EST 2018 | davef
Media Links IPC Global Insight This weekly electronic newsletter includes IPC news and multimedia information on manufacturing and management best practices and solutions, new technologies, standards, government relations and environment, health and
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar
Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res
