Industry News | 2018-06-20 20:36:50.0
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.
Industry News | 2016-07-02 06:45:13.0
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017. The extended deadline is July 8, 2016.
Industry News | 2019-09-10 13:25:11.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.
Industry News | 2017-07-17 18:33:56.0
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018. The extended deadline for technical conference abstracts is July 21, 2017.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2021-06-09 04:40:39.0
IPC commends the Biden administration for completing its 100-day review of strategically important supply chains and for outlining bold actions to strengthen U.S. semiconductor manufacturing and ensure the availability of minerals critical to electronics manufacturing.
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)
Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
