Industry Directory | Manufacturer
PCB Assembly in Indonesia with ISO Certificate Are you looking for SMT and PCB Assembly ? We provide SMT and PCB Assembly service in Indonesia. Located at bonded zone West Java Indonesia. Suitable for export oriented market.
Industry Directory | Manufacturer
EMSYDEL Electronics is a India based EMS services company capablae of working with complex Boards using SMT, THT lead free services. Run by technocrats , EMSYDEl differentiates itself through a planned and Tailored client benefits association.
General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)
Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
Electronics Forum | Wed Aug 20 17:05:42 EDT 2008 | naynayno
We have experienced contamination under flat chip arrays. The lab report is still open but it appears to be dendrite growth. We have been trouble-shooting our process and cleaning equipment. My question is are there any specific design or best p
Electronics Forum | Wed Aug 20 20:10:30 EDT 2008 | davef
Naw, accounting is boring. Standoff could be an issue. Coupla things: * Above 30 thou, just about any cleaning process, more sophisticated than a garden hose, will produce acceptable results * Below 10 thou, can be cleaned with best efforts, but not
Used SMT Equipment | Pick and Place/Feeders
Small foot print GSM with Linear Motors like a Genesis. Flip Chip Application Die Attach Application Building CBGA (ceramic ball grid array) and CCGA (ceramic column grid array) components. Building PBGA (plastic ball grid array) com
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
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Parts & Supplies | Pick and Place/Feeders
JUKl FX3 Ejector Unit Assy 40112421 Part number: 40112421 Application: FX3 Brand: JUKI FX3 Ejector Unit Assy 40112421 is a spare part for JUKI pick & place machine FX-3, ZK Electronic Technology have original new in stock, if you consider it
Parts & Supplies | Pick and Place/Feeders
JUKI HN001490000 CLAMP FILTER(L) FUJINTAI TECHNOLOGY CO.,LTD JUKI HN00149000A CLAMP FILTER www.fujintai.com JUKI HN00167000A SURGE ABSORBER FUJINTAI TECHNOLOGY CO.,LTD JUKI HN001960000 NOISE FILTER www.fujintai.com JUKI HN001970000 SURGE ABSORBER
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Welcome to this Defect of the Month video on via hole failures and how to see them, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of
This is the first in a series of 10-minute videos to introduce new users to the basics of machine vision technology. In this video, users will learn what machine vision is, how it is used in factory automation, and its four most common applications.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | TULSA, Oklahoma USA | Engineering,Production,Purchasing,Research and Development
This opportunity is with a global industry leader designing and manufacturing sophisticated electronic assemblies and sub-assemblies. These products play a very significant role throughout the world providing essential equipment and components to the
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support
SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 14, (#ts#)) SMT Express, Volume 2, Issue No. 4 - from SMTnet.com Volume 2, Issue No. 4 Wednesday, April 19, 2000
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 17, (#ts#)) SMT Express, Volume 2, Issue No. 5 - from SMTnet.com Volume 2, Issue No. 5 Wednesday, May 17, 2000
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
Coating and Potting Connector Assembly to PCB DFX/Design for Six Sigma Direct Chip Attach to PCB (DCA) Dispensing & Underfill Epoxy Fluxes Facility Layout Halogen and Halogen-Free Head on Pillow Defect/Warpage Induced Solder Joint Defects High Melting Point Solder Laser Soldering Leadless Area Array Packages Lead
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/surface-mount-adhesive-sma?con=t&page=6
(SMA) applications Products Content Your results for: Surface Mount Adhesive (SMA) Jetting Dispensing of Fluxes for Flip Chip Attachment and Measurement Methods for Ensuring Consistent Flux Coatings Nordson ASYMTEK S. Adamson, S. Heveron-Smith (Lumetrics
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