Full Site - : chip self alignment (Page 11 of 68)

TAB Excise and Form Tooling

New Equipment |  

TAB Excise and Form Tooling. This tooling will excise and form TAB devices to customers specifications. This tooling is self aligning and quick change and will fit into any of our Vertical Access Presses. This tooling incorporates a keeper bar cla

DIETEK Tools, Inc.

Ekra E5

Ekra E5

Used SMT Equipment | Screen Printers

right, right--> left, left-> left, right--> right, pass through Conveyor configuration front or rear fix PCB transport width adjustment motorised, software controlled PCB warpage 1% of PCB diagonally, up to a max. of 11 mm including PCB thickness S

Recon Inc

Juki KE760L

Juki KE760L

Used SMT Equipment | Pick and Place/Feeders

JUKI KE760L / Zevatech FM760 : Completely working machine in good conditions, with some spare parts, nozzles renewed, spare mainboard/computer with LCD, manuals, etc. Supplied with 2troleys with about 70 various feeders, rack for spare feeders availa

LEDeco solution,s.r.o.

Cyberoptics CyberOptics LNC60 Laser Align Laser sensor

Cyberoptics CyberOptics LNC60 Laser Align Laser sensor

Parts & Supplies | Chipshooters / Chip Mounters

CyberOptics LNC60  Sensor in stock for sale, brand new originala and used available. Supply CyberOptics Laser sensor and SMT spare parts, JUKI Laser for JUKI750 760 2010 2020 2030 2050 2060 FX-1 2070 2080 machine.CyberOptics Laser repair serivce.

Shenzhen Dingji Technology CO.,Ltd

Mid America (UK) Ltd

Industry Directory | Distributor

Formed in 1990, we supply SMT Splicing Tapes & SMT Adhesives. We are the exclusive European & USA distributor for Fuji Chemical Industrial Co Ltd, Japan.

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Essemtec Expert-SAFP (110V/230V configu

Essemtec Expert-SAFP (110V/230V configu

Parts & Supplies | Pick and Place/Feeders

Expert-SAFP (110V/230V configurable) NEW PRICE EUR30.000,-, now for EUR 18.500 net (excl. Tax) only. Perfect for fast and reliable Prototyping. For sale is an Essemtec Expert-SAFP (110V/230V configurable). The Expert-SAFP is a professinal semi-

Arsenal Testhouse GmbH

HEPCO 9400-1 BGA Solder Sphere Placement System

HEPCO 9400-1 BGA Solder Sphere Placement System

New Equipment | Pick & Place

The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re

HEPCO, Inc.

JOT Optical BGA Rework Station FG-

JOT Optical BGA Rework Station FG-

Parts & Supplies | Repair/Rework

Three independent heaters control systems. FG-P6000 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking

Goodluck Electronic Equipment Co.,Ltd

Wafer Level Chip Scale Marker : CSM 2000

New Equipment |  

User friendly operating software, Ultra stable diode-pumped Nd :YAG green laser, Support Wafer Size : 4,5,6 & 8" wafers, option : 8 to 12" wafers, Absolutely free from damage on the fabricated wafer, High accurate marking position alignment using th

EO Technics Co., Ltd.


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