Used SMT Equipment | Screen Printers
Speedprint SP700 avi Specs: WATCH the performance of this system NOW on our website under VIDEOS Description: This machine is as new so we will provide Installation, training and full FIVE YEAR warranty. * High Precision Axes Linear rail & bel
The SUSS MicroTec MA100RR Reel-to-Reel Proximity Mask Aligner is specifically designed for volume production of tape for tape carrier packages (TCP) and flex based chip scale packages (CSPs), like the �BGA. The tool can also be used for products requ
Parts & Supplies | SMT Equipment
30534502 RELAY,SOLID STATE 30534706 RD LD C&C CABLE ASM 30534708 C&C SENS CABLE ASSY 30534901 ROT TABLE CABLE ASM 30534902 ROT TABLE CABLE ASSY 30535801 REPLACED BY: 30535802 30535802 PIN 30538301 FIBER OPTIC 30538701 COVER WIREWAY
Technical Library | 2016-11-03 17:53:56.0
We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip.In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
New Equipment | Rework & Repair Equipment
The X-1 Precision SMT/BGA Rework Station is a flexible system designed for manual alignment and placement or removal of BGA, microBGA, Flip Chip, CSP and other surface mount electronic components with precisely controlled solder reflow profiles. The
Jwide SMD taping machine with CCD camera is used to detect empty components or components in wrong direction. For details,pls visit us: www.jwide-smt.com sales@jwide-smt.com
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Condition: New Machine Type: Machine for soldering&removing a chip Applicable Industries: Machinery Repair Shops, Manufacturing Plant, Retail, Personal repair shop, Repair shop, University Laboratory After Warranty Service: Video technical support
