Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Industry News | 2021-04-19 03:58:42.0
Whizz Systems, Inc., the award-winning premier provider of electronics product design, development, and manufacturing services located in the heart of the Silicon Valley, today announced the appointment of Humza Babar as its new Marketing Associate.
Industry News | 2003-06-18 07:56:46.0
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2002-03-29 08:28:28.0
Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England
Industry News | 2003-05-22 08:14:29.0
RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module
Industry News | 2003-04-30 08:37:19.0
Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs
Industry News | 2019-01-17 20:36:59.0
MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce the appointment of Kirby & Demarest as its manufacturers’ representative. Kirby & Demarest will provide sales and support for MIRTEC’s award-winning inspection systems in Oregon, Washington, Idaho, Montana and the Province of British Columbia. The rep firm provides high technology companies an array of products utilized in the design, manufacturer and test of circuit board assemblies, hybrid circuits, and semiconductors.
Industry News | 2003-03-06 08:43:16.0
Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.
