Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
RollPruf tri-polymer blend of neoprene, nitrile and natural rubber in 8 mil, hand specific design provides optimum comfort, reduced hand fatigue, with durability and strength uncommon to latex gloves. Applications: Chip Assembly Photomask Assembly Ph
We manufacture Copper Bonded Earth Rods from high tensile-low carbon steel compiling with requirements of BS 4360 Grade 43 A. Each Copper Bonded Earth Rod is molecularly bonded by 99.99% pure, high conductivity copper bonding, each rod is treated wit
Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Mon Jul 30 21:29:34 EDT 2001 | kennyhktan
Hello Michael & All, Thanks for the feedback. Months ago we receive a number of reject concerning one of the 0805 & 0603 chip capacitor mising (with joint remain on pad)and seriously solder joint fracture. From there I had do some investigation
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2022-02-10 16:41:20.0
Says action must be paired with rebuilding the broader European electronics manufacturing ecosystem
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 XP ball spline： XP141E Z-axis ball spline：DEPH1031 XP243/XP143/XPF的X all spline：DNSX1010 XP243 Y-axis ball spline：GFSY3311 XP243 bearing for Y-axis ball spline：H4217T XP142/XP14
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2024-06-23 22:03:59.0
The melting temperatures of most lead-free solder alloys are somewhat higher than that of eutectic Sn/Pb solder, and many of the alloys tend to wet typical contact pads less readily. This tends to narrow down the fluxing and mass reflow process windows for assembly onto typical organic substrates and may enhance requirements on placement accuracy. Flip chip assembly here poses some unique challenges. The small dimensions provide for particular sensitivities to wetting and solder joint collapse, and underfilling does not reduce the demands on the intermetallic bond strength. Rather, the need to underfill lead to additional concerns in terms of underfill process control and reliability. Relatively little can here be learned from work on regular SMT components, BGAs or CSPs.
ETA Online Jet Dispensing Machine D400 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Dispensing Machine,SMT Glue Dispensing Machine,Dispe
I.C.T PCB LED Dispensing Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt,Dispensing Machine,SMT Glue Dispensing Machine,Dispensing
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/micro-testing-thin-die
SEMI G96-1014 Chip (Die) strength by cantilever bending Different bend methods such as 3 point , 4 point , ring on ring and ball on ring (spherical bend
