Industry News | 2013-05-22 14:12:24.0
Engineered Material Systems, Inc. (EMS) debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.
Industry News | 2014-01-09 10:39:28.0
Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2014-03-31 16:21:29.0
Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2015-01-27 09:40:03.0
Engineered Material Systems is pleased to debut its 535-11M-3 UV cured epoxy. 535-11M-3 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.
Industry News | 2015-04-20 18:19:42.0
Engineered Material Systems is pleased to debut its 535-11M-7 UV cured epoxy. 535-11M-7 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.
Industry News | 2018-02-14 10:15:17.0
Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
Industry News | 2008-07-24 18:07:41.0
When DEK's revolutionary VectorGuard� stencil technology was introduced six years ago, the company pledged ongoing engineering investments to deliver foil designs to serve countless next-generation applications. Living up to this promise, DEK's latest advance, VectorGuard Platinum�, was introduced last week at Semicon West and its ingenuity earned a prized Advanced Packaging Award.
Industry News | 2012-09-17 15:38:30.0
SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
