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MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

SMTnet

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

Zarlink Sells Wafer Facility to X-Fab for $30M

Industry News | 2002-03-29 08:28:28.0

Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England

SMTnet

More Light from Smaller LEDs

Industry News | 2003-04-23 08:21:34.0

Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.

SMTnet

MIRTEC PICKS UP ITS 24TH INDUSTRY AWARD AT SMTAI

Industry News | 2014-09-30 18:49:51.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2014 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.

MIRTEC Corp

XEMICS' New 433MHz and 868MHz ETSI/FCC Compliant RF Modules

Industry News | 2003-05-22 08:14:29.0

RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module

SMTnet

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

MIRTEC RECEIVES A GLOBAL TECHNOLOGY AWARD FOR ITS MV-9XP LED PACKAGE INSPECTION SYSTEM

Industry News | 2013-11-13 12:39:14.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.

MIRTEC Corp


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