Industry News | 2013-01-17 09:22:05.0
FCT Assembly announces that it will highlight its new NanoSlic™ Multilayer Coating for the first time in booth #2627 at the upcoming IPC APEX EXPO
Electronics Forum | Tue May 15 11:55:16 EDT 2001 | dason_c
We had a same problem before and Cirtech work with FAB supplier. It is due to the contamination on the tank. No special profile and paste use on the immersion tin board. Dason
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Sat Oct 06 08:27:24 EDT 2001 | davef
Yes, some solder masks do not tent well, because the material is too thin. That�s the trade-off. Thin masks: * Conform well to [don't bleed onto] fine pitch features. * Tent vias poorly, requiring an additional "plugging" step. As you imply, if th
Electronics Forum | Fri Sep 03 12:36:27 EDT 2004 | Frank R.
That's what I have ... two 5 zone reflow. A representative from AIM told me that 7 zone reflow is required with PbFree. It's good to know that it work fine with a 5 zones. Florida cirtech is the company who told me that SN100C do not damage your w
Electronics Forum | Sat Mar 05 22:44:44 EST 2005 | gpaelmo
You can also try the Florida Circtech website or call them direct. There is a min. thickness requirement and if the board house does not follow it you will end up with scrap boards after the second pass (from experience). I even sent blank boards to
Electronics Forum | Fri Jul 14 16:35:03 EDT 2000 | Dave F
Celia: Ubet. Sorry about the ranting. (It comes with the territory.) I don�t recall any peer reviewed stuff, but I seem to remember a couple of articles on white tin in "SMT" "Circuits Assembly" Magazine (er suppin� like that), but it was probabl
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Mon Nov 19 20:15:39 EST 2001 | davef
Now, that is one thickass board!!! The rant first: If our �board supplier changed our board surface finish on� anything without our approval, the board supplier would be an �X�. Life has enough surprises. And of all the flat finishes available, h
Electronics Forum | Mon Apr 23 19:12:23 EDT 2001 | relensky
Thanks for the instructions. I was missing the reflow part... Omikron is the method our board house offers. We have been through the plating thickness problem and tin depletion conditions. Beyond those issues, I have been trying a few different n
