Clad Metal Manufacturer Supplying Stampers and OEM's worldwide for over 15 years. Aerospace, Appliance, Automotive, Electronics, Military, Telecom. AS9000,QS9000,ISO9002 CERTIFIED. OUR ENGINEERS ARE AVAILABLE TO WORK WITH YOU FROM PROTOTYPE THRU PRODUCTION QUANTITIES. VISIT OUR WEBSITE TO SEE EXAMPLES OF CLAD PRODUCTS.
supplier of clad & pure nickel powders and conductive fillers; additives used in the formulation of thermally & electrically conductive polymers, elastomers (emi gaskets and seals) & plastics with rf emi shielding properties.
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
Electronics Forum | Thu Mar 31 13:48:19 EST 2005 | shannond
Hi All, I have to solder a device with platinum clad nickel leads to a PCB. I am having a hard time getting solder to flow on to the leads. Are there special proceedures that I need to follow because of the platinum or am I just dealing with contamin
Electronics Forum | Fri Apr 01 10:35:09 EST 2005 | shannond
Definitely platinum http://www.omega.com/Temperature/pdf/1PT100FR_RTD_ELEMENTS.pdf
Used SMT Equipment | In-Circuit Testers
Ribbon Fiber Arc Fusion Splicer Key Features Up to 12-fiber ribbon splicing. Cladding alignment with fixed v-grooves. Environment resistant features. Arc calibration-free system. 4.1" TFT color LCD monitor. Dual direc
Used SMT Equipment | In-Circuit Testers
Fujikura FSM-50R MASS FIBER FUSION SPLICER (Model : FSM50R) Key Features: Suitable for Ribbon Fiber Splicing FSM-50R12 : Splicing up to 12-Fiber Ribbon FSM-50R8 : Splicing up to 8-Fiber Ribbon Cladding Alignment with fixed v-grooves Dual-d
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-04-04 08:21:57.0
The deal emphasizes PIAD�s commitment to being a major supplier to the UK printed circuit market and enhances Crossley & Bradley�s position as a leading distributor of copper-clad laminates in the UK
Parts & Supplies | Assembly Accessories
PC12P Inventory Material: Copper Clad FR4, Single Sided, 2 oz. Series: - Size Dimension: 18.00" x 12.00" (457.4mm x 304.8mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: Copper Clad, Positive Sensitized PC12P-E RFQ
Parts & Supplies | Board Cleaners
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Technical Library | 2021-03-04 15:22:33.0
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4- phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1.
Technical Library | 2017-08-24 16:53:20.0
With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In addition to the increasingly high performance requirements of CCL's, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics. (...) This paper introduces a new phosphonate oligomer which can be used as a reactive flame retardant in epoxy based resin systems. Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented.
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
Career Center | Mt. View, California USA | Engineering
In this position you will become part of a team that is aimed at developing new and advanced devices for the Optical Telecommunications Market. Based on Spectra-Physics� experience in lasers and semiconductor diode lasers, we are developing fiber las
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Process Technician in our Lighting Manufacturing facility in Racine, Wisconsin. Summary: This person will be a primary contributor to the startup of a new SMT production line for LED PCB Assembly. This
SMTnet Express, August 24, 2017, Subscribers: 30,744, Companies: 10,648, Users: 23,699 Development of Halogen Free, Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer Dr. Lawino Kagumba - FRX Polymers Inc. ., Yang Zhong Qiang
ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
.) Class All Properties Polybutylene terephthalate (PBT) - clad aluminum, copper or tin-plated copper . EM-1305 NC Al 0.002 0.009 94V-2 50 EM-2305 NC Cu 0.002
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
