Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter
> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.
Electronics Forum | Wed Feb 12 16:48:31 EST 2014 | gmcquoid
We are having an internal debate here related to minimum Conductor Width. Can you have your QA manager review this and advise. IPC-6012C-2010 3.5.1 Conductor Width and Thickness When not specified on the master drawing the minimum conductor width s
Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef
First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi
Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz
I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w
Electronics Forum | Thu Aug 07 14:08:30 EDT 2008 | arminski
Can A Company or Electronic Manufacturing Company go for AS9100 certification if the Quality Policy states that we only meet IPC Class 2 Standard? I'm just very confused for I know AS9100 is an Aerospace Quality System and must meet IPC Class 3. thi
Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes
60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept
Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy
1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3
Electronics Forum | Tue Jun 20 21:30:05 EDT 2006 | davef
The minimum vertical hole fill is defined as follows: Class 1: Not specified, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side. Cl
Electronics Forum | Fri Oct 12 16:01:23 EDT 2018 | davef
Feature||Class 1||Class 2||Class 3 Circular wetting of solder of the lead and plated hole barrel on the component side.||Not Specified||180 deg||270 deg Plated hole fill.||Not Specified||75%||75% Circular fillet and wetting of solder of the lead a
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
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